Laser Packaging Development Engineer
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-09-02
Listing for:
Intel
Full Time
position Listed on 2026-09-02
Job specializations:
-
Engineering
Packaging Engineer, Quality Engineering, Manufacturing Engineer, Process Engineer
Job Description & How to Apply Below
Intel is seeking a Packaging Module Development Engineer in Laser Assembly based in Phoenix, AZ. You will design laser-assisted packaging processes, optimize performance, and collaborate across teams to advance next-generation semiconductor packaging.
The role emphasizes DOE-driven process development, data analysis, and ensuring manufacturability and reliability of packaging solutions in a fast-paced environment.
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