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Packaging Engineer: Media, Collaterals & Processes; Onsite
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-09-08
Listing for:
Intel
Full Time
position Listed on 2026-09-08
Job specializations:
-
Engineering
Manufacturing Engineer
Job Description & How to Apply Below
Intel seeks an experienced engineer in Phoenix to develop assembly processes and equipment for next‑generation packaging. You will optimize package manufacturing to meet quality, reliability, cost, yield, and productivity targets, and define specifications using DOE and SPC methods.
The role requires strong CAD skills in Solid Works and AutoCAD, plus a portfolio of projects from concept to fabrication. On-site work in Phoenix is expected.
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