Intel Process Integration Engineer BE

Job Details:

Job Description:

Join Intel and build a better tomorrow.

What we do:

The Intel Foundry MDCE and Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel’s product roadmap.

What we offer:

We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).

We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work. Benefits:
We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative rewards that make Intel a Great Place to Work. Find more information about our amazing benefits here.

The ideal candidate should exhibit behavioral traits that indicate:

• Develop and define integrated front end process flows for new technology nodes.
• Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, and metrology teams.
• Establish process windows and integration schemes.

• Analyze yield loss and parametric failures.
• Perform root cause analysis using statistical tools (SPC, DOE, FMEA).
• Drive corrective actions to improve yield and cycle time.

• Ensure electrical parameters meet design targets.
• Work closely with device engineers to tune process conditions.
• Optimize critical dimensions (CD), overlay, and film thickness.

• Implement control plans and process monitoring strategies.
• Use statistical tools such as:
  Cpk / Ppk, Control charts, Capability analysis.

• Support ramp from RnD to high-volume manufacturing (HVM).
• Document process specifications and standard operating procedures (SOPs).

• Device Engineering
• Equipment Engineering/Module Engineering
• Yield Engineering
• Reliability Teams
• Design Teams

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

• Candidate must possess a PhD degree in one of these fields:
  Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline.
• Candidate must possess at least one of the following: 6+ months experience on one or more of the following areas:
  Semiconductor device fabrication or nanotechnology. Electrical characterization of transistors or other semiconductor devices. Clean room process development.

• JMP, MATLAB, Scripting languages (1.e. Python, JSL, TCL), or programming languages (1.e. SQL, C/C++).
• Strong understanding of Device physics (CMOS, FinFET, GAA, etc)
• Hand on experience in VLSI device fabrication and testing in the lab.
• Knowledge of basic VLSI fabrication instruments (1.e. mechanism of dry etcher, ALD (atomic layer deposition), PE CVD, metallization, etc.)
• Understanding statistical process control and charting methodology data flow and integrity. Strong data analysis and presentation acumen.
• Integrated process knowledge, including strong design of experiments and model-based problem-solving skills for complex problems, excursions, and defects.
• Knowledge of automation and defect classification systems in a fab environment.
• Strong stakeholder management and influencing skills. Experience in…