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Senior Program Manager – Chiplet Packaging
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-07-25
Listing for:
Amkor Technology, Inc.
Full Time
position Listed on 2026-07-25
Job specializations:
-
Manufacturing / Production
Operations Management, Packaging Engineer
Job Description & How to Apply Below
Amkor Technology, Inc. in Tempe, AZ is seeking a BU Product Management leader for Advanced Chiplets/FCBGA Packaging.
The role centers on program management, managing key customer accounts, and driving internal process development to support customers, offshore factories and supplier teams while qualifying and ramping chiplet/FCBGA products. The ideal candidate will partner with BU members to hit annual goals, promote packaging technologies to customers, translate requirements into manufacturing
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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