More jobs:
Shift Module Engineer, Advanced Packaging Tech
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-08-25
Listing for:
Intel
Full Time
position Listed on 2026-08-25
Job specializations:
-
Manufacturing / Production
Packaging Engineer
Job Description & How to Apply Below
Intel's Advanced Packaging Technology Development Substrate and Wafer Assembly (APTD SWA) organization seeks a Module Engineer On Shift to provide real-time factory support, addressing equipment and process issues and ensuring continuous 24/7 lot movement on the production line in Phoenix.
The MEOS role emphasizes troubleshooting, RFCs, tool enablement, and collaboration across engineering teams, with opportunities to impact packaging technology and product quality in a fast-paced semiconductor
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