Head of Advanced Packaging and Chiplet Integration
Listed on 2026-09-16
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Manufacturing / Production
Packaging Engineer
Jobtailor seeks a leader to drive advanced packaging integration research in the United States. You will guide a multidisciplinary team to translate system requirements into robust package solutions, focusing on heterogeneous integration, chiplets, 2.5D/3
DIC, and wafer-level packaging.
You will define strategy, roadmaps, milestones, and decision criteria aligned to product scaling. The role requires collaboration with silicon design, substrates, assembly, reliability, and manufacturing teams,
Consider building your career as a Head of Advanced Packaging and Chiplet Integration at Jobtailor.
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This posting is for the Head of Advanced Packaging and Chiplet Integration role at Jobtailor, based in AZ, United States.
We are looking to fill the Head of Advanced Packaging and Chiplet Integration position at Jobtailor in AZ, United States.
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