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Speed Mixed-Signal Design Engineer

Job in Placentia, Orange County, California, 92670, USA
Listing for: Mesh
Full Time position
Listed on 2026-05-07
Job specializations:
  • Engineering
    Electronics Engineer, Systems Engineer, Electrical Engineering, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below
Position: High-Speed Mixed-Signal Design Engineer

Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that’s exactly what we’re doing at Mesh.

Our optical hardware platform requires tightly integrated high-speed electronic and photonic systems operating at tens of gigahertz and beyond—modulator drivers, trans-impedance amplifiers, Ser Des interfaces, and the analog signal chains that connect them. We are seeking a High-Speed Mixed-Signal Design Engineer to architect, design, and validate the high-speed electronic systems that interface directly with our photonic integrated circuits. You will work across the boundary between electronics and photonics, from transistor-level circuit design through package and board-level integration, ensuring the electrical systems meet the bandwidth, linearity, and noise performance our optical links demand.

RESPONSIBILITIES:

  • Design and analyze high-speed analog and mixed-signal circuits for electro-optic systems, including modulator drivers, TIAs, CTLEs, limiting amplifiers, and clock/data recovery circuits
  • Develop and own circuit-level and system-level models for high-speed signal chains, incorporating device parasitics, package effects, and photonic component behavior
  • Perform transistor-level simulation and verification using industry tools (e.g., Cadence Virtuoso, Spectre, ADS, HFSS) across process corners, temperature, and supply variation
  • Architect high-speed electrical interfaces between electronic ICs and photonic integrated circuits, defining impedance matching, bandwidth targets, voltage swing, and power constraints
  • Lead or contribute to chip-to-package-to-board co-design, including high-speed interconnect design, SI/PI analysis, and signal integrity closure from die through PCB
  • Collaborate with PIC designers to co-optimize electro-optic performance across the driver–modulator and photodetector–TIA interfaces
  • Define characterization and validation strategies for high-speed electronic and electro-optic subsystems, including S-parameter measurements, eye diagram analysis, and BER testing
  • Analyze measurement data and correlate to simulation models, driving root-cause investigation and design iteration
  • Partner with manufacturing and test engineering teams to develop production test methods for high-speed electrical and electro-optic assemblies
  • Contribute to component selection, evaluation, and qualification for high-speed electronic devices (e.g., driver ICs, TIAs, CDRs, PLLs)

QUALIFICATIONS:

  • Master's or PhD in electrical engineering, applied physics, or a related discipline
  • 3+ years of experience in high-speed analog, mixed-signal, or RF circuit design, with emphasis on circuits operating at multi-GHz bandwidths
  • Strong foundation in analog and RF circuit design principles, including small-signal and large-signal analysis, noise analysis, and stability
  • Experience with circuit simulation tools (e.g., Cadence Spectre, ADS, HFSS, or equivalent)
  • Understanding of high-speed serial link architectures and signaling formats (e.g., NRZ, PAM4, coherent modulation)
  • Experience with high-speed lab characterization, including use of high-bandwidth oscilloscopes, VNAs, BERTs, and spectrum analyzers
  • Working knowledge of semiconductor device physics and IC fabrication processes (CMOS, SiGe BiCMOS, or III-V)
  • Strong programming and data analysis skills (e.g., Python, MATLAB) for simulation automation, data processing, and visualization
  • Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE:

  • Experience designing high-speed circuits for optical communications, including modulator drivers, TIAs, or Ser Des front-ends
  • ASIC or custom IC design experience, including full design flow from specification through tapeout and silicon validation
  • Experience with high-speed package and interconnect design, including wirebond, flip-chip, or co-packaged optics integration
  • Deep expertise in one or more of: wideband amplifier design (>25 GHz), high-speed DAC/ADC interfaces, PLL/CDR design, or RF power amplifier design
  • Familiarity with DSP concepts relevant to optical links (e.g., FFE,…
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