Specialist, Mechanical Engineering

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Harris is the Trusted Disruptor in defense tech. With customers’ mission‑critical needs always in mind, our employees deliver end-to-end technology solutions connecting the space, air, land, sea and cyber domains in the interest of national security.

Job Code: 36665
Job Location: Plano, TX (Onsite)
Job Schedule: 9/80 - Employees work 9 out of every 14 days – totaling 80 hours worked – and have every other Friday off

The Agile Development Group (ADG) specializes in developing disruptive, next‑generation technologies for advanced Unmanned Air Systems (UAS / UAV), advanced radar systems, next‑generation weapon systems, and other RF sensor technologies using small company agility and big company experience. The team is seeking an Electronic Packaging Mechanical Engineer to work with a cross‑functional team to assist development, design, and implementation of radar systems.

The position will follow the product from conceptualization through hardware integration and test. The position will interface with Designers, Thermal/Structural Analysts, Systems Engineers, other engineering disciplines, Program Managers, and customer counterparts. The position will require leading portions of the mechanical engineering activities related to the design, analysis, documentation, fabrication, assembly and qualification of product to the specification requirements, typically with stringent technical, schedule, and process requirements.

Candidate must have experience in 3D modeling and be able to work under moderate supervision on tasking that is typically assigned with high level requirements. Candidate must have the ability to work independently and within a multi‑disciplined team environment.

• Primary engineering responsibility for mechanical design tasks of electronics packaging such as requirements analysis, specification generation, interface definition, component selection, component 3D CAD modeling, data collection, product documentation, and product validation.
• Understand schedule, cost, and technical responsibility at the component or subsystem level.
• Prototype and test component parts and assemblies.
• Develop test plans and procedures for mechanical subsystems.
• Perform test and evaluation of component parts and systems.
• Participate in peer reviews, PDRs, CDRs, and other required design reviews.
• Participate in interdisciplinary design teams and reviews.
• Adhere to company processes for product development, configuration management, purchasing, etc.
• Direct Designers/Technicians as part of a design team.
• Perform trade studies to determine optimal designs.
• Conceptualize new designs to solve mechanical demands.
• Expertise in engineering documentation/Drawings IAW ANSI Y14.100.
• Ability to obtain security clearance.

• Bachelor’s Degree and minimum 4 years of prior relevant experience OR Graduate Degree and a minimum of 2 years of prior related experience OR in lieu of a degree, minimum of 8 years of prior related experience.
• 2+ years of experience packaging electronics including design for and testing to military environments (i.e. temperature, vibration, shock, etc.).

• Existing Secret clearance preferred.
• Experience with standard ASME Y14.5M-1994 and GD&T.
• Experience with MS Office suite.
• Experience in 3D CAD modeling – PTC Creo, Catia, NX, or Solidworks.
• Experience with thermal management principles.
• Excellent people skills, with experience working and collaborating in a multi‑disciplinary, diverse, and dynamic team environment.
• Excellent communication skills (written, verbal, & presentation).
• Strong hands‑on capabilities, to include integration of mechanisms and products.

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