Advanced Lead - SiC​/GaN Power Module Packaging Engineer

Job Description Summary

Are you ready to see your career take flight? At GE Aerospace, we believe the world works better when it flies. We are a world-leading provider of jet engines, components, and integrated systems for commercial and military aircraft. We have a relentless dedication to the future of safe and more sustainable flight and believe in our talented people to make it happen.

The Advanced Lead - SiC/GaN Power Module Packaging Engineer will focus on the design of power modules along with development, optimization, and implementation of manufacturing processes for both GaN and SiC power modules. These advanced semiconductor power modules are critical for high-efficiency high power density power electronics.

In this role, you will be responsible for developing, optimizing, and implementing manufacturing processes for existing and new Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules. You will participate in power module design and simulation analyses, and will work closely with mechanical designers, quality, and production teams to ensure the efficient and reliable production of high-performance GaN and SiC power modules.

In addition, you will be involved in troubleshooting, process improvement, and ensuring compliance with industry standards and safety regulations.

GE Aerospace, based in Pompano Beach, is a global powerhouse in the aviation industry, specializing in cutting-edge aircraft engines, systems, and avionics. The Advanced Technology Organization is responsible for driving growth through technology by researching customer needs both met and unmet, then finding solutions. Our team supports both military and commercial customers in land, sea, and air domains.

Job Description

Role & Responsibilities

Power Module Design and Simulation

* Collaborate with power module design team, provide insight on the developed module performance using simulation tools.

* Collaborate with design and R&D teams to ensure manufacturability and scalability of new GaN and SiC power module designs.

Process Development

* Develop and optimize manufacturing processes for GaN and SiC power modules, including die attach, wire bonding, encapsulation, and testing.

Process Optimization

* Identify and implement process improvements to enhance yield, efficiency, and reliability of GaN and SiC power module production.

* Utilize statistical process control (SPC) and other quality tools to monitor and improve process performance.

Quality Control

* Develop and implement quality control procedures to ensure compliance with industry standards and customer requirements.

* Conduct root cause analysis and implement corrective actions to address process-related quality issues.

Documentation and Reporting

* Guide the team to maintain detailed process documentation, including process flow diagrams, work instructions, and standard operating procedures (SOPs).

* Prepare technical reports and presentations to communicate process development and improvement activities.

Training and Support

* Train production staff on new processes and equipment.

* Provide technical support to production teams to resolve process-related issues.

Safety and Compliance

* Ensure all manufacturing processes comply with safety regulations and company policies.

* Participate in regular safety audits and risk assessments to identify and mitigate potential hazards.

Required Qualifications

* Master's degree or higher in Electrical Engineering, Materials Science, Chemical Engineering, or a related field.

* Minimum of 3 years of experience in semiconductor manufacturing with a focus on power module packaging.

Additional Information

* GE Aerospace will not sponsor individuals for employment visas, now or in the future, for this job opening

* Ability and willingness to sit onsite at our Pompano Beach, FL facility location.

Desired Qualifications

* PhD degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related field.

* Experience with GaN and SiC power module manufacturing and packaging technologies.

* Familiarity with industry standards and regulations related to power electronics.

* Strong knowledge of semiconductor fabrication processes, materials, and equipment.

* Excellent problem-solving and analytical skills.

* Strong communication and interpersonal skills.

* Ability to work collaboratively in a cross-functional team environment.

Some of our competitive benefits package includes:

* Medical, dental, and vision insurance that begins on the first day of employment

* Permissive time off policy for newly hired employees

* Generous 401(k) plan

* Tuition Reimbursement

* Life insurance and disability coverage

* And more!

The base pay range for this position is $,000. The specific pay offered may be influenced by a variety of factors, including the candidate's experience, education, and skill set. This position is also eligible for an annual discretionary bonus based on a percentage of your base salary/ commission based on the plan. This posting is…