Materials & Process Engineering - Avionics​/Electrical

Responsibilities

• Develop, test, and qualify materials and processes supporting the manufacturing, fabrication, and installation of avionics hardware, including PCB/PCBA assembly, soldering, conformal coating, staking, potting/encapsulation, cable/harness assembly, and electronic packaging.
• Establish and maintain Standard Operating Procedures (SOPs), process specifications, work instructions, and travelers for avionics manufacturing operations.
• Develop and lead Failure Mode and Effects Analyses (FMEAs) for manufacturing and installation processes to identify risk and drive robust, repeatable production.
• Implement, audit, and continuously improve manufacturing best practices to increase quality, yield, and manufacturing velocity.
• Independently plan, manage, and execute coupon-level, component-level, and subscale process qualifications and verification campaigns with minimal guidance.
• Establish and qualify critical assembly processes (e.g., reflow/wave soldering profiles, surface preparation, cleaning, conformal coat application, and curing) to ensure robust, reliable hardware.
• Scale up materials and assembly processes from prototype to production-scale realization on flight hardware.
• Review test and inspection results from processed hardware, evaluate findings, and disposition non-conformances (MRB support).
• Work with an interdisciplinary team of design, manufacturing, and tooling engineers, as well as skilled operators, to develop fixturing, tooling, and assembly procedures for flight avionics.
• Provide day‑to‑day manufacturing support on the shop floor, in clean rooms, electronics labs, and integration areas, including travelers, safety protocols, ESD controls, and material traceability.
• Manage technical relationships with material suppliers, component manufacturers, and equipment vendors.
• Apply general shop and laboratory compliance, including personal protective equipment (PPE), Foreign Object Debris (FOD) prevention, contamination control, and ESD control.
• Travel as needed to support design interface meetings, equipment support, or off‑site development activities.
• Maintain a safe, clean, and organized work area in alignment with 5S standards.

• B.S. degree or higher in Electrical Engineering, Materials Science & Engineering, or a relevant technical engineering field.
• 5+ years of experience in avionics manufacturing, fabrication, or installation within aerospace, defense, or advanced electronics environments.
• Industrial experience in one or more core electronic M&P areas: electronic packaging, PCB/PCBA fabrication and assembly, soldering processes, conformal coatings, staking/potting/encapsulation, or cable and harness manufacturing.
• Demonstrated experience developing manufacturing SOPs, process specifications, FMEAs, and work instructions.
• Technical understanding of electronic materials and processes, including solder metallurgy, surface preparation, adhesion, and material compatibility on aerospace electronic assemblies.
• Ability to read and interpret complex engineering drawings, electrical schematics, wiring diagrams, CAD models, and material callouts.
• Self‑motivated and proactive, with a demonstrated ability to drive process development, qualification, and improvement to completion with little guidance.
• Strong technical writing skills with demonstrated capability to author process specifications, test reports, and manufacturing work instructions.
• Approachable disposition, broad‑minded, and adaptable to rapidly changing requirements.
• Calm demeanor in high‑pressure situations with the tenacity to resolve conflict for permanent problem resolution.
• Ability to earn trust, maintain positive and professional relationships.
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

• Master's degree in Materials Science & Engineering, Electrical Engineering, or a related field.
• Hands‑on experience with electronic assembly processes such as reflow/wave soldering, automated dispensing, conformal coat application, and encapsulation.
• Familiarity with workmanship and reliability standards for electronics (e.g.,…