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Senior Hybrid Bonding Process Engineer (Die-to-Wafer
Job in
Portland, Multnomah County, Oregon, 97204, USA
Listed on 2026-08-11
Listing for:
TalentAlly
Full Time
position Listed on 2026-08-11
Job specializations:
-
Engineering
Electronics Engineer
Job Description & How to Apply Below
Intel in the United States is seeking a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding. You will drive equipment development and manufacturability for next‑generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will apply deep technical expertise in hybrid bonding process or equipment engineering to support both first‑of‑a‑kind platform development and manufacturing
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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