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Senior Module Process Engineer – CMP

Job in Post Falls, Kootenai County, Idaho, 83854, USA
Listing for: Jobtailor
Full Time position
Listed on 2026-09-05
Job specializations:
  • Engineering
    Process Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 160000 USD Yearly USD 120000.00 160000.00 YEAR
Job Description & How to Apply Below
Position: Senior Staff Module Process Engineer – CMP
  • Serve as a technical expert in Chemical Mechanical Planarization (CMP) Process with a strong Wafer Fab background
  • Perform data analytics to identify, troubleshoot, and solve complex CMP Process, Yield, and Integration problems
  • Lead customer discussions to understand High Value Problems (HVP)
  • Propose and implement Continuous Improvement Projects (CIP)
  • Capture learning to maximize service opportunities and implement solutions improving customer KPIs
  • Increase CSA value through defect, variability, and COO reduction and PM/process Cpk, matching, and output optimization
  • Identify opportunities for CSA renewal, upsell, and penetration
  • Demonstrate and drive adoption of new service technologies, including Fab Vantage Offerings, through demos, on-site evaluations, and Joint Development Programs
  • Resolve complex tool issues using analytics, equipment and process knowledge, and Fab Vantage troubleshooting methodologies
  • Issue reports and present findings to customers, explaining priorities and recommendations based on BOM, EC, FSS, and FV360 data comparisons
  • Mentor and lead junior-level MPEs
  • Lead and contribute to the CMP network of experts and Community of Practice
Requirements
  • 10+ years’ experience in Chemical Mechanical Planarization (CMP) Process
  • Strong Wafer Fab background
  • Data analytics background for analyzing, troubleshooting, and solving complex CMP Process, Yield, and Integration problems
  • BS - Engineering
  • Wafer Fab Process / Equipment experience
  • Advanced integration knowledge
  • Domain knowledge of 3 or more types of CMP processes
  • Familiarity with Applied equipment
  • Ability to communicate complex ideas, anticipate objections, and persuade others, often at senior levels
  • Regarded as the technical expert in CMP Unit Process and Wafer Fab operations
  • Willingness to travel 20% of the time
Core Competencies

Demonstrates extensive expertise in Chemical Mechanical Planarization (CMP) processes and Wafer Fab operations, leveraging data analytics to troubleshoot and optimize yield and integration issues. Proven ability to lead continuous improvement projects and mentor junior engineers while effectively communicating complex technical concepts to stakeholders.

Highest-signal resume keywords
  • Chemical Mechanical Planarization (CMP) Process Expertise
  • Data Analytics for CMP Process Optimization
  • Wafer Fab Process and Equipment Experience
  • Advanced Integration Knowledge
  • Technical Communication and Persuasion Skills
Hard Skills
  • Chemical Mechanical Planarization (CMP)
  • Data Analytics
  • Wafer Fab Operations
  • Process Yield Optimization
  • Continuous Improvement Projects (CIP)
  • Defect Reduction
  • Process Cpk
  • Fab Vantage Offerings
  • CMP Process Troubleshooting
  • Integration Problem Solving
Soft Skills
  • Mentoring
  • Leadership
  • Communication
  • Persuasion
  • Customer Engagement
Certifications & Qualifications
  • BS in Engineering
Industry Keywords
  • Wafer Fab
  • CMP Process Types
  • High Value Problems (HVP)
  • Customer KPIs
  • Community of Practice
Tools & Technologies
  • Applied Equipment
  • Fab Vantage
  • BOM
  • EC
  • FSS
  • FV360
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Position Requirements
10+ Years work experience
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