CLAWS Packaging Engineer
Job in
Raleigh, Wake County, North Carolina, 27611, USA
Listed on 2026-06-02
Listing for:
North Carolina State University
Full Time, Part Time
position Listed on 2026-06-02
Job specializations:
-
Engineering
Electrical Engineering, Systems Engineer, Electronics Engineer
Job Description & How to Apply Below
Hub leadership, Distinguished Professors John Muth and Fred Kish, are dedicated to the "lab to fab" journey-translating laboratory advancements into fabrication capabilities for wide bandgap semiconductors. The hub brings together a dynamic partnership with N.C. A&T State University and industry leaders, including Wolfspeed, Coherent Corp., General Electric, Bluglass, Adroit Materials, and Kyma Technologies, Inc. This collaborative effort will propel the development of semiconductors crucial for national defense, electric vehicles, power grid technologies, 5G/6G, quantum technologies, and artificial intelligence applications
Wolfpack
Perks and Benefits
As a Pack member, you belong here, and can enjoy exclusive perks designed to enhance your personal and professional well-being. As you consider this opportunity, we encourage you to review our Employee Value Proposition and learn more about what makes NC State the best place to learn and work for everyone.
What we offer:
* Medical, Dental, and Vision
* Flexible Spending Account
* Retirement Programs
* Disability Plans
* Life Insurance
* Accident Plan
* Paid Time Off and Other Leave Programs
* 12 Holidays Each Year
* Tuition and Academic Assistance
* And so much more!
Attain Work-life balance with our Childcare benefits, Wellness & Recreation Membership, and Wellness Programs that aim to build a thriving wolfpack community.
Disclaimer: Perks and Benefit eligibility is based on Part-Time or Full-Time
Employment status . Eligibility and Employer Sponsored Plans can be found within each of the links offered.
Essential
Job Duties
We are seeking an experienced semiconductor device Packaging Engineer to join our research foundry team, supporting the development of advanced RF, Power, and Photonic devices and integrated circuits. The ideal candidate will have expertise in the development and integration of packaging processes as well as package design and assembly. The engineer will work closely with device, process, and test engineers to define interconnect strategies, perform thermal and mechanical analysis, and ensure compatibility with wafer-level processes and test infrastructure.
Key Responsibilities:
Lead packaging of wide bandgap semiconductor devices (30%)
* RF devices including HEMTs and MMICs
* High power electronic devices including HEMTs, FETs, and diodes
* Visible spectrum optoelectronic devices and Photonic Integrated Circuits.
Packaging Design and Assembly Workflows (25%)
* Specify package solutions that meet the performance requirements of new technology platforms in collaboration with CLAWS teams.
* Define scalable workflows to realize packaged discrete devices, integrated circuits, or modules.
* Participate in cross-functional design initiatives that improve performance, manufacturability, yield, or reliability.
Process Integration (25%)
* Lead the development and integration of processes in, for example, die attach, wire bonding, and encapsulation.
* Analyze package and module performance. Inform electrical, thermal, and mechanical simulations with design and characterization data.
* Troubleshoot process integration challenges related to defectivity, yield, and reliability.
Cross-functional Collaboration (20%)
* Collaborate with circuit designers, applications engineers, and product development teams to realize integrated system-level advantages.
* Stay up to date with emerging technology trends, competitive landscape, and industry benchmarks.
Other Responsibilities
The successful candidate will:
* Comply with stated workplace policies.
* Communicate results, plans, and other updates to a variety of audiences.
* Adhere to and mentor others in known best practices.
* Support CLAWS activities…
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