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Process TD Engineer

Job in Rancho Cordova, Sacramento County, California, 95741, USA
Listing for: Solidigm
Full Time position
Listed on 2026-06-24
Job specializations:
  • Engineering
    Manufacturing Engineer, Process Engineer
Salary/Wage Range or Industry Benchmark: 138560 - 221700 USD Yearly USD 138560.00 221700.00 YEAR
Job Description & How to Apply Below

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start‑up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas.

Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions.

You can be part of the takeoff of an innovative business that develops cutting‑edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization.

We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team‑oriented, inclusive, results driven, collaborative, passionate, and flexible.

Key Responsibilities Simulation and Analysis
  • Perform simulations using ANSYS to predict mechanical behavior
  • Analyze stress, strain, and failures in components and assemblies under environmental and operational conditions.
  • Analyze stress, strain, and failures in SSD rework and disassembly condition
New Product Introduction (NPI) Development
  • Define and establish SSD manufacturing process flows, procedures, and equipment configurations for electronic modules.
  • Develop and characterize new assembly and rework processes for SSDs across multiple form factors.
  • Select, qualify, and develop materials and equipment to meet manufacturability, reliability, yield, and productivity targets. Create, validate, and document manufacturing recipes and process parameters for High Volume Manufacturing (HVM) transfer.
Process & Technology Development
  • Develop and implement rework solutions and techniques for SSD modules, including PCBA component replacement and product disassembly.
  • Continuously explore and validate new rework techniques to support evolving SSD technologies and complex designs. Perform process data analysis, risk assessment (TRA), and implement process controls throughout the Product Life Cycle (PLC).
  • Support design for manufacturability and assembly (DFM/DFA) reviews and provide feedback to product development and cross‑functional teams.
Cross-Functional Collaboration
  • Work closely with design, quality, planning, commercial, and supply chain teams to ensure seamless NPI to HVM transition and production ramp‑up.
  • Collaborate with ODMs and suppliers to explore and develop advanced manufacturing and rework technologies.
Required Skills & Competencies
  • Strong understanding of electronics product design, system analysis, and manufacturing processes
  • Expertise in component-level manufacturing with a focus on process, materials, and new technique development.
  • Experience in process development, integration, and continuous improvement.
  • Proficiency in DFX (Design for Excellence) principles for PCB and mechanical assemblies.
  • Solid foundation in statistics and data‑driven process control.
  • Excellent problem‑solving, communication, and cross‑functional collaboration skills.
Education & Experience

Bachelor’s degree in Electrical, Mechanical, Automation, or Materials Engineering with 5+ years of relevant experience; or Master’s degree in the above disciplines with 3+ years of experience.

The compensation range for this role is $138,560 - $221,700. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.

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