Sr. RF and Wireless Systems Engineer, Leo Digital RF Systems

Sr. RF and Wireless Systems Engineer, Amazon Leo Digital RF Systems

Amazon Leo is Amazon’s low Earth orbit satellite network dedicated to delivering fast, reliable internet connectivity to customers beyond the reach of existing networks.

As a Senior RF and Wireless Systems Engineer in the Digital RF Systems team, you will define and design RF architecture, line‑up, and specifications for custom ASICs used in Leo phased array systems. You will collaborate with RFIC, DSP, firmware, and manufacturing teams to ensure optimal system‑level RF performance through analysis, simulation, prototyping, testing, and yield optimization.

• Own end‑to‑end RF architecture and line‑up design for the Leo RFICs and phased array communication systems.
• Define RF specifications and key performance requirements for custom ASIC development.
• Simulate and characterize RF impairments’ impact on the system.
• Review RFIC designs for compliance with system performance targets.
• Research and implement calibration and correction algorithms for RF front‑end impairments.
• Develop post‑silicon lab validation plans for RF characterization.
• Identify and resolve RF performance bottlenecks through measurement and analysis.
• Balance power, cost, and throughput trade‑offs to meet product requirements.
• Support ASIC production data reviews to drive yield improvements with manufacturing engineering.
• Serve as the RF systems point of contact across silicon design, firmware, software, and test teams.

• Master’s degree or Ph.D. in Electrical Engineering or a related field.
• 7+ years of wireless DSP/RF systems engineering experience (LTE, 5G‑, Wi‑Fi, BLE).
• In‑depth knowledge of RF architectures and low‑power RFIC/ASIC design.
• Solid understanding of RF blocks, components, and simulation tools.
• Experience in RF impairment estimation and compensation techniques.
• Working knowledge of firmware implementation of DSP algorithms for RF impairment compensation.
• Experience with lab equipment, chip bring‑up and validation.
• Proficiency in MATLAB, Python, and/or C/C++ for fixed‑point DSP and RF impairment modeling.

• Strong background in the RFIC design process.
• Experience designing low‑power or area‑efficient digital signal processing blocks for wireless RF SoCs.
• Excellent grasp of RF architectures and blocks used in wireless SoCs.
• MATLAB, Python, C++ experience with emphasis on fixed‑point DSP modeling and RF calibration algorithm development.
• Familiarity with phased array systems and performance‑optimization techniques.
• Experience with silicon bring‑up and use of vector spectrum analyzers, signal generators, high‑speed oscilloscopes, and logic analyzers.
• Proficiency in Ansys HFSS and Keysight ADS simulation tools.

Due to export control laws, candidates must be a U.S. citizen, permanent resident, or lawfully admitted refugee/asylee.

Amazon is an equal‑opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

US salary ranges for the San Diego and Redmond locations: $159,200 – $215,300 annually. Your package will include sign‑on payments and restricted stock units (RSUs). Benefits include health, dental, vision, and additional plans, 401(k) matching, paid time off, and parental leave.