Thermal Design Engineer

Thermal Design Engineer

Legrand has an exciting opportunity for a Thermal Design Engineer to join the Data Power and Control Team in Reno, NV. The team seeks a highly motivated engineer to support the development and optimization of next‑generation power distribution and infrastructure products for data center environments. The role will be responsible for designing, analyzing and improving product‑level thermal performance through simulation‑driven design methodologies.

The ideal candidate has hands‑on experience with computational fluid dynamics (CFD) modeling, finite element analysis (FEA), and thermal simulation of electro‑mechanical systems within a CAD‑integrated digital twin or multi‑physics simulation environment. This position will work cross‑functionally with mechanical, electrical, and manufacturing engineering teams to ensure products meet performance, reliability, and efficiency requirements across demanding operating environments, including high‑current and liquid‑cooled applications aligned with Open Compute Project (OCP) architectures.

• Perform thermal analysis and simulation of electro‑mechanical products using Autodesk CFD and Omniverse‑enabled simulation environments.
• Model heat transfer behavior including conduction, convection, and liquid cooling systems.
• Develop simulation‑driven design improvements to optimize product performance, power density, and thermal efficiency.
• Support new product development (NPD) initiatives through early‑stage design validation and risk mitigation.
• Evaluate thermal performance of high‑current busbars, PDUs, and liquid‑cooled power distribution systems.
• Collaborate with mechanical and electrical engineers to integrate thermal solutions into product architecture.
• Generate simulation reports to support design reviews and qualification efforts.
• Support validation testing efforts by correlating simulation results with empirical data.
• Participate in design for manufacturability (DFM) and reliability assessments.
• Assist in failure analysis and root cause investigations related to thermal performance issues.
• Other duties as assigned.

Education: Bachelor's degree from a four‑year college or university with emphasis in Mechanical or Electrical Engineering or comparable experience or related field; or an equivalent combination of education and experience.

Experience: 3+ years of experience in thermal design of electro‑mechanical or power electronic products.

Skills/Knowledge/Abilities:

• Experience with thermal management of high‑power electrical systems or data center infrastructure.
• Familiarity with liquid cooling systems and cold‑plate design.
• Experience working with busbar systems, PDUs, or rack‑level power distribution.
• Knowledge of OCP hardware architectures and data center cooling methodologies.
• Exposure to multi‑physics simulation environments.
• Experience integrating Autodesk Inventor CAD designs into simulation environments.
• Experience supporting rack‑level liquid‑cooled 48V or 400V power architectures.
• Experience with writing ECOs using PLM software.
• Experience with performing Hipot, SELV, and thermal testing.
• Ability to coordinate engineering projects and demonstrate engineering technical expertise to a team.
• Effective oral and written communication skills with the ability to provide information across multiple groups in the Company including Engineering, Marketing, and Sales.

Equal Opportunity Employer