Senior Verification Engineer, HBM
Listed on 2026-02-04
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Engineering
Systems Engineer, Software Engineer, Electronics Engineer, Hardware Engineer
Overview
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
The Heterogeneous Integration Group (HIG
) is a division within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using TSV (Through Silicon Via), we stack multiple DRAM chips on a high-speed memory controller with an integrated logic chip in one package, significantly increasing memory density and bandwidth through parallelization. Our ultimate goal is to deliver the lowest power per bit solutions in the industry.
Micron is hiring!! We are looking for a Senior Verification Architect working on architecting and developing modular, scalable verification solutions for the next generation HBM DRAM products spread across different customer platforms. You will be part of a highly multi-functional team of technical domain expert collaborating closely with a diverse team of Design Engineering, Product Engineering & Business Units and external customer teams to deliver to a common goal of ensuring our future HBM roadmap is successful.
You will apply your deep understanding of testbench architecture, custom design verification methodologies, SoC verification methodologies, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures and solutions to target best in class scalability, quality, testbench performance and verification cycle time.
Deliver high-quality, on-time, verification and architecture deliverables
Participate in co-verification of overall system through direct customer interactions
Develop turnkey verification solutions for future designs based on look ahead information available from customers and the rest of the architecture team
Build verification methodology improvements and GenAI applications with a roadmap aligned to the HBM design cycles
Contributing to cross group communication to work towards standardization and group success
Attract, recruit, train, engage and retain top talent to build a world-class design architecture team
Challenge the team to set and achieve stretch objectives while focusing on continuous improvement in schedules, quality and capability
Build team culture of hard work, innovation, and strong global collaboration with a focus on Micron’s Values
Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures
Engage with Customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions
Pathfinding to explore new architectures for future HBM products and make recommendations after performing highly technical feasibility analyses
B achelors or greater in relevant engineering field.
3 years of relevant e ngineering experience.
2+ years of experience in either - digital (Verilog) , analog ( Fast Spice ) , mixed signal verification (co-sims or real number modeling )
1+ years of experience in either custom design verification or schematic based verification
Excellent problem-solving and analytical skills
Good verbal and written communication skills with the ability to effectively synthesize and convey complex technical concepts to other partners and leadership
MSEE or higher.
5 years of relevant engineering experience.
One or more patents/trade secrets/publications showcasing innovation and problem-solving in verification solutions
Track record of building or reworking verification flows from scratch
1+ years of experience in memory products with standardized specifications such as JEDEC, preferably with HBM product family
Understand the complete scope of pre-silicon verification for products from design kick-off to tapeout
Good understanding of Memory subsystem operation in high-performance computing applications
As a world leader in the semiconductor industry, Micron is…
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