SMT Process Engineer IV

Job Summary

The SMT Process Engineer IV is a senior‑level technical expert responsible for optimizing and maintaining surface mount technology (SMT) processes to ensure high‑quality, efficient, and cost‑effective electronic assembly. This role involves advanced troubleshooting, process development, and continuous improvement initiatives across multiple SMT lines, often acting as a lead or mentor within the engineering team.

• Lead the development, implementation, and optimisation of complex SMT processes, including stencil printing, pick-&place FUJI, reflow soldering, and automated optical inspection (AOI).
• Conduct advanced root cause analysis and implement corrective actions for SMT process defects (e.g., shorts, opens, voids, component placement issues) using statistical process control (SPC) and other analytical tools.
• Design and execute experiments (DOE) to improve SMT process robustness, yield, and throughput, focusing on new product introduction (NPI) and existing product enhancements.
• Collaborate with design engineering, manufacturing, and quality teams to ensure manufacturability (DFM) and resolve complex technical issues related to SMT assembly.
• Develop and maintain comprehensive process documentation, work instructions, and training materials for SMT operators and technicians.
• Evaluate and recommend new SMT equipment, materials, and technologies to enhance capabilities and improve manufacturing efficiency.
• Provide technical mentorship and guidance to junior engineers and manufacturing personnel on SMT best practices and problem‑solving techniques.
• Drive continuous improvement projects using Lean manufacturing and Six Sigma methodologies to reduce waste and increase productivity within SMT operations.
• Monitor key performance indicators (KPIs) for SMT processes and present findings and recommendations to management.
• Ensure compliance with all relevant industry standards, safety regulations, and quality management systems (e.g., ISO, IPC).

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field. Master’s degree preferred.
• 8+ years of progressive experience in SMT process engineering within a high‑volume electronics manufacturing environment.
• Expert‑level knowledge of SMT equipment (e.g., printers, pick-&place machines, reflow ovens, AOI/SPI) from various manufacturers (e.g., Fuji, Universal, Koh Young, Agilent).
• Deep understanding of IPC-A-610 and J-STD-001 standards.
• Proficiency in statistical process control (SPC), design of experiments (DOE), and advanced problem‑solving methodologies (e.g., 8D, Six Sigma).
• Strong analytical skills with the ability to interpret complex data and make data‑driven decisions.
• Demonstrated ability to lead technical projects and drive process improvements.
• Excellent communication, interpersonal, and presentation skills, with the ability to effectively collaborate with cross‑functional teams and mentor others.
• Experience with CAD/CAM software for SMT programming and DFM analysis is a plus.
• Ability to work effectively in a fast‑paced, dynamic manufacturing environment.