Memory Design Engineer, HBM

Req  Staff Memory Design Engineer, HBM. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products.

We are engaged in developing groundbreaking silicon‑to‑systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time‑to‑market, and customer satisfaction.

• Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.
• Create optimized floor plans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.
• Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.
• Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.
• Prepare and maintain design documentation while contributing to best‑known practices and departmental training.
• Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.
• Manage layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.
• Prepare project status reports and lead design reviews to communicate progress and technical decisions.

• Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.
• Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.
• Strong analytical and problem‑solving skills with proven significant technical contributions and a record of innovation.
• Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience.
• Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market.

• Self‑motivated with strong problem‑solving abilities and a drive to discover new solutions.
• Deep knowledge of industry‑specific technologies and competitive trends.
• Excellent communication and interpersonal skills for cross‑functional collaboration.
• BS or MS in Electrical Engineering or related field plus 6 years of experience in DRAM design, product, or system.

Job Profile(s):
Semiconductor Design Engineer 4 - Semiconductor Design Engineer 5

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.