Sr System Design Engineer

Vision

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The core mission of this position is to fundamentally understand HBM cube behavior and failure modes through meticulous bench testing, structured experimentation, and data-driven analysis. The engineer will generate high-quality characterization data, connect observations across domains, and translate insights into actionable structural, technical, packaging, test, and product solutions.

• Compose, build, and debug custom bench setups, fixtures, and measurement flows using lab equipment such as power supplies, SMUs, oscilloscopes, thermal hardware, handlers, sockets, and probe cards.
• Perform full thermal and mechanical stress characterization using bench stress platforms while monitoring electrical behavior under controlled stress.
• Conduct hot/cold, transient, and forced‐temperature testing with precision thermal systems to enable power–temperature correlation and failure‐onset analysis.
• Develop Python, Verilog, and C/C++ test programs to build targeted stress patterns, segmented workloads, custom modes, and observability hooks that accelerate root‑cause isolation.
• Drive correlation of bench results with assembly, test, and system‑level data, including DOE‑based studies to isolate sensitivities and interactions across thermal, mechanical, electrical, and structural domains.
• Analyze MBIST signatures and electrical or thermal behavior; trace issues back to building, technology, package, or assembly root causes.
• Collaborate with test teams on improved screens and content.
• Lead failure‑mode identification and statistical analysis of multifaceted datasets to deliver clear, evidence‑backed recommendations for building, process, package, or test mitigations while partnering closely with HBM Build, DTPCO, Technology Development, Packaging, Test, Product Engineering, and Reliability teams.

• B.S. or equivalent experience with 8 years of proven experience (also acceptable).
• M.S. or equivalent experience in electrical engineering, computer engineering, mechanical engineering, materials science, or a related field is required.
• Hands‑on experience with silicon or package‑level characterization, bench/ATE testing, or product/test engineering.
• Confirmed understanding of electrical measurement techniques, lab instrumentation, and test platforms.
• Experience with programming and data analysis (Python, JMP/JSL, C/C++, or similar).
• Proven understanding of statistics and experimental methods (DOE).

• Direct experience with HBM, DRAM, or advanced memory products.
• Experience running or analyzing MBIST‑based testing and correlating to silicon behavior.
• Background in package product engineering, test solutions engineering, or silicon characterization.
• Familiarity with thermal and mechanical modeling concepts and correlation to lab data.
• Demonstrated ability to turn characterization data into actionable engineering decisions.

• Medical, dental, and vision plans available nationwide.
• Income protection benefits for illness or injury.
• Paid family leave, paid time‑off program, and paid holidays.
• Additional benefits are described in the Benefits Guide posted at

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.