Design Engineer - Sustaining, HBM

Req  – Staff Design Engineer - Sustaining, HBM

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions. The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high‑performance computing (HPC), and data‑centric systems, collaborating across global engineering and product teams to deliver industry‑leading performance, power efficiency, and reliability.

As an HBM Memory Design Engineer – Sustaining (Staff), you will work closely with cross‑functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to analyze and resolve silicon issues across HBM products. You will collaborate with architecture to understand new or updated specification requirements and contribute to the implementation, verification, and maintenance of design updates, supporting both silicon release and ongoing product lifecycle needs.

• Silicon Debug:
  Own end‑to‑end debug of silicon, system, and customer issues, driving root‑cause analysis and resolution.
• Cross‑Functional
  
  Collaboration:
  
  Work closely with DE, PE, TD, and system teams to execute issue resolution and ensure alignment on priorities.
• Design Support:
  Implement and verify design updates (ECOs/spec changes) and support sustaining design maintenance.
• Quality & Yield Improvement:
  Identify and debug yield, reliability, and performance issues to improve product quality.
• Customer Support:
  Support customer bring‑up, qualification, and system‑level debug activities as needed.
• Continuous Improvement:
  Contribute sustaining learnings to improve design quality, debug efficiency, and verification methodologies.

• 6+ years (BS) or 4+ years (MS) in Electrical Engineering, Computer Engineering, or related field
• Strong understanding of DRAM/HBM architecture and high‑speed memory interfaces
• Experience in digital and/or custom design and verification
• Hands‑on experience in silicon debug or post‑silicon validation
• Ability to independently drive complex technical issues to closure

• Experience with HBM/DDR/LPDDR or high‑speed IO systems
• Background in system‑level debug and silicon‑to‑system correlation
• Knowledge of timing and margin analysis, signal and power integrity
• Experience with DFT / mBIST / test‑mode debug
• Programming/scripting skills (Python preferred) for debug automation
• Strong communication skills with ability to work across cross‑functional teams

Micron offers medical, dental, vision plans, paid time‑off and holidays. Micron is proud to be an equal‑opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.