HBM Product Engineer

Req  HBM Product Engineer

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Design, analyze, and validate test structures and layout for advanced HBM (High Bandwidth Memory) products. Collaborate with cross‑functional teams including design, process, and package engineering to optimize thermal, electrical, and mechanical reliability. Perform failure analysis, resistance extraction, and design rule verification using tools such as Cadence Virtuoso, Calibre, and scripting languages. Lead efforts in layout optimization and co‑design with package and die teams for product qualification and yield improvement.

Create test structures, test chip development, design rule development and product layout feature analysis for chip package interactions.

• Ph.D. in Electrical and Computer Engineering, Thermal and Semiconductor Processing or related fields.
• Data analysis.
• Layout and design rule check.
• 3D integration.
• Semiconductor process knowledge.
• Thermal simulation expertise.

Job Profile(s):
Product Development Engineer 3

Relocation Level: TBD

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.