HBM Product Engineer

Responsibilities

• Design, analyze, and validate test structures and layout for advanced HBM (High Bandwidth Memory) products.
• Collaborate with cross‑functional teams including design, process, and package engineering to optimize thermal, electrical, and mechanical reliability.
• Perform failure analysis, resistance extraction, and design rule verification using tools such as Cadence Virtuoso, Calibre, and scripting languages.
• Lead efforts in layout optimization and co‑design with package and die teams for product qualification and yield improvement.
• Create test structures, test chip development, design rule development and product layout feature analysis for chip package interactions.

• Ph.D. in Electrical and Computer Engineering, Thermal and Semiconductor Processing or related fields.
• Strong skills in data analysis.
• Expertise in layout and design rule check.
• Experience with 3D integration.
• Knowledge of semiconductor process.
• Proficiency in thermal simulation.

Micron offers a choice of medical, dental, and vision plans in all locations, along with income protection benefits, paid family leave, a robust paid time‑off program, and paid holidays.

Micron is a proud equal opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.