Principal Memory Design Engineer, HBM Richardson, Texas, Posted

Position: Principal Memory Design Engineer, HBM Richardson, Texas, United States of America Posted a day ago
## Principal Memory Design Engineer, HBMRichardson, Texas, United States of America
** Our vision is to transform how the world uses information to enrich life for
* all*.
** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Principal Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while leading layout processes and ensuring robust verification and reliability. This role collaborates cross‐functionally to support manufacturability, drive innovation for future memory generations, and oversee project activities from design through validation and review.
** Responsibilities
* ** Design and implement DRAM circuits, including digital, analog, and memory core circuitry, based on device specifications.
* Create and optimize floor plans for circuit placement, signal routing, power delivery, sense margins, timings, and die size.
* Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, speed, and reliability.
* Model parasitics in simulation, verify routing and power integrity, and support validation, reticle experiments, and tape-out revisions.
* Confirm simulation-to-silicon correlation and recommend schematic edits.
* Contribute to documentation, training, standardization efforts, and cross-group communication.
* Manage build and layout resources, monitor task progress, and lead technical reviews.
* Serve as a primary contact for design, layout, verification, and testing while preparing project status reports.
** Requirements
* ** Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with knowledge of device reliability.
* Expertise in Cadence Virtuoso, physical layout, and circuit floor planning.
* Experience with FINESIM, HSPICE, and VERILOG simulation tools.
* Strong analytical and problem‐solving abilities with significant technical contributions and innovation history.
* Deep expertise in DRAM subsystem architecture, specification, operation, or design, including cross‐department technical leadership.
** Preferred Qualifications
*** Highly self‐motivated with strong problem‐solving instincts and a passion for discovering new solutions.
* In‐depth awareness of industry‐specific technologies and trends.
* Excellent communication and interpersonal skills.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on .Micron is proud to be an equal opportunity workplace and is an affirmative action employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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