Principal RF Designer and Architect

Senior Design Engineer – Mixed Signal Integrated Assemblies

Qorvo, Inc is currently seeking a Senior Design Engineer responsible for the design and development of mixed signal integrated assemblies providing command, communications, control and interface of radio electronics. In this position you will report directly to the Director of Systems Engineering in the Systems, Research & Technology Department and will take a technical leadership role in developing RF, analog and digital circuitry employed in a wide variety of product development projects.

You will address all aspects of circuit design & development, including but not limited to:

• Driving technical definitions & specifications of next generation products
• Presentations & proposals to management and customers
• Linear & non‑linear simulations and component selection
• PCB design, fabrication, testing and verification to design specifications

You will be working with Electrical & Mechanical Design Engineering, Marketing, and the Product Line to develop products & technology for next generation of RF systems. The ideal candidate will hold a MSEE with PhD preferred, and relevant experience in electronic design in the wireless communications industry including RF & microwave circuit design, analog design with discrete devices & ICs, digital logic, active & passive filter design, interface electronics, data acquisition, embedded controller hardware design and power management.

• Lead multiple cross‑functional and cross‑site engineering teams in the design and development of command, control, communications and interfacing electronics for RF components and signal chains.
• Develop requirements and specifications for assemblies used in products needed for next generation systems in infrastructure & defense markets.
• Perform analysis and simulations of various approaches, tradeoffs and approaches to verification and validation.
• Identify required circuit functions based on requirements performance parameters and allocate sub‑system partitioning to each function.
• Provide technical inputs for PCB thermal analysis and analyze any resultant impact on reliability.
• Define RF circuit interfaces and integration requirements based on partitioning.
• Develop plans for integrated assembly and RF component integration, and for performance evaluation.
• Integrate sensors, component controls and data acquisition blocks with embedded controllers & digital signal processing functions.
• Provide design documentation necessary to realize integrated assemblies and their interconnection with hosts.
• In conjunction with Test engineering, develop strategies and execution plans for automated test capability of integrated assemblies.
• Review customer’s requirements and technology proposals to identify potential applicable company products & technology.
• Work with engineering development groups and marketing during product development cycles to ensure products meet customer specifications and requirements.
• Travel within US to visit customers, company design centers and industry partners – up to 25%.

• Develop specifications and generate proposals for mixed signal SMT assemblies employed in RF and microwave signal chains.
• Design command, communications, control and interface circuitry for RF integrated assemblies.
• Perform linear, non‑linear & time domain simulations of active & passive circuits including filters, amplifiers, digital & analog multiplexers, interface electronics, embedded controllers and power management.
• Employ time domain simulation methods to accurately predict electronic circuit performance and impact on overall assembly performance.
• Invent novel mixed signal circuit design solutions that provide robust performance relative to requirements and specifications.
• Develop & demonstrate temperature compensation techniques for RF components and line‑ups.
• Design & develop signal processing line‑ups and RF chains from ADC/DAC to RF input/output.
• Analyze dynamic range performance based on noise figure, phase noise, quantization error, ADC SNR, filter group delay, isolation, and amplifier linearity.
• Relate spectral mask of transmitters back to signal processing chain…