Principal HIG ESD and Latch-up Engineer- HBM - TPG

ESD & Latch Up Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are part of Micron's HBM Design Architecture organization, where we push the limits of memory technology every day. Our team works across global, multicultural engineering groups to build next-generation HBM solutions that power AI and machine learning. We believe the best ideas come from collaboration, curiosity, and a shared drive to innovate!

This role plays a critical part in ensuring the reliability of Micron's most advanced DRAM and HBM products. As an ESD & Latch Up Engineer, you will shape protection strategies from early design through high-volume manufacturing, working hands-on with silicon, layout, and foundry partners. If you enjoy solving deep technical problems and influencing product robustness at scale, this role offers both impact and growth.

Responsibilities:

• Define and own chip-level and IP-level ESD and latch up strategies for HBM DRAM, base die, I/O, TSVs, and die-to-die interfaces
• Establish ESD and latch up requirements, targets, and sign-off criteria aligned with JEDEC/ESDA standards
• Enable ESD protection circuits and latch up safe layout practices across designs and technologies
• Lead silicon validation, failure analysis, and correlation of pre-silicon assumptions to silicon results
• Act as the technical interface to foundries and partner closely with design, packaging, reliability, and product teams

Minimum Qualifications:

• Master's degree or Ph.D. in Electrical Engineering or equivalent industry experience
• Strong fundamentals in ESD physics, latch up mechanisms, and advanced CMOS devices
• Hands-on experience with ESD protection circuits and latch up prevention techniques
• Familiarity with JEDEC and ESDA standards, including HBM, CDM, and JESD
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Preferred Qualifications:

• Experience supporting ESD and latch up sign-off for advanced DRAM or HBM products
• Knowledge of SCR-based clamps, distributed ESD networks, and rail-based strategies
• Experience working directly with foundry ESD and latch up teams
• Proven ability to mentor engineers and influence design methodology across teams

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$ - $ a year

Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training.

The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.