HBM SIPI, Staff Engineer

Position Overview

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using Through Silicon Via (TSV) technology, we stack multiple DRAM chips with a high‑speed interface die, significantly increasing memory density and bandwidth for next‑generation AI/ML accelerators and high‑performance computing platforms.

Our designs target the industry's lowest power‑per‑bit and highest bandwidth, enabling the most demanding compute workloads.

SI/PI Engineer in HBM Design Architecture – Execute high‑quality SI/PI analysis for interposers, packages, and silicon channels, contributing directly to HBM design sign‑off and product success. Involved in complex, multi‑disciplinary SI/PI initiatives spanning multiple HBM product generations – from early interposer channel analysis and equalization co‑design, PDN architecture, and system PI analysis. Ensure Micron's HBM SI/PI architecture remains the industry benchmark for signal quality, power delivery integrity, and interface reliability.

• Signal integrity channel analysis for 2.5D and 3D silicon interposer – include frequency‑domain characterization (insertion loss, return loss, PSXT, IL‑to‑XT ratio) and time‑domain analysis (eye diagram, BER, jitter decomposition).
• Conduct mask‑based timing analysis using time‑domain simulations (e.g., SPICE, ADS).
• Support power integrity and PDN analysis, including impedance modeling and transient response analysis.
• Electromagnetic extraction and modeling of signal and power delivery channels (PCB, package, interposers, etc.).
• Automate sign‑off processes and collaborate with EDA suppliers to improve tool accuracy and analysis flow.

• 5 years of experience in signal integrity (SI) and power integrity (PI) modeling and analysis.
• Deep understanding of SI/PI, electromagnetic and transmission line theory, I/O design.
• Experience in circuit simulation such as Keysight ADS and Synopsys HSPICE.

• 7+ years of experience in SI/PI and power delivery network (PDN) modeling and analysis.
• Experience in SI/PI modeling and analysis for 2.5D/3D advanced packaging (CoWoS, EMIB, interposer‑based designs), including time‑domain analysis (eye diagram, BER, jitter decomposition, PDN) and frequency‑domain characterization (S‑parameters, PDN impedance).
• Experience with mask‑based timing budget and jitter analysis using time‑domain simulation (SPICE, ADS, etc.).
• Experience with high‑speed interfaces such as DDR, HBM, UCIe, PCIe, and SERDES.
• Proficiency in simulation and analysis using industry‑standard EDA tools, including ANSYS HFSS/SIwave, Keysight ADS, Synopsys HSPICE, Cadence PowerSI/PowerDC.

$ – $ a year (US base salary range)

Additional compensation may include benefits, bonuses and equity.

Micron offers a range of medical, dental, and vision plans in all locations, as well as protection for income if unable to work due to illness or injury, paid family leave, robust paid time‑off program, and paid holidays. For additional information regarding benefit programs, visit

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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