Principal Advanced Packaging Mechanical Engineer

Principal Advanced Packaging Mechanical Engineer

Location:

Richardson, TX, US, 75081

Experience Level: Professional

Job Type: Regular

Requisition

We are looking for an experienced Principal Mechanical/Thermal Engineer to join the Defense & Aerospace product development team. The successful candidate will lead mechanical design and analysis efforts of electronics packaging for defense communications, radar and electronic warfare applications.

• Principal level Mechanical/Thermal Engineer developing next-generation microelectronic packaging technology with emphasis on advanced packaging design.
• Work closely with a select team of IC designers, module designers, process engineers, and CAD tool set specialists to develop products and development tools to move state-of-the-art packaging technology forward.
• Develop electronic package designs to be used for R&D prototypes and standard products.
• Generate IP to drive forward packaging technology with emphasis on thermal performance and high frequency operation.
• Research and evaluate emerging materials for use in future product offerings.
• Guide package and substrate design decisions that meet performance specifications and yield requirements.
• Supervise and respond to manufacturing issues as they occur.
• Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si, and provide input to implement these technology trends.

• BSME/MSME degree in Mechanical Engineering or other relevant field with a minimum of 12 years’ experience in semiconductor packaging.
• Experience in the design of packaged microelectronic assemblies for defense, avionics, aerospace, or automotive industries.
• Experience with micro-fluidics within an electronics packaging environment.
• Expert level skill with Solid Works or similar.
• Expert knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies.
• Experience with microelectronic package assembly processes including die attach, wire bond, flip‑chip, epoxy dispense, encapsulation, and solder reflow.
• Knowledge of microelectronic inspection tools and equipment, and similar knowledge of failure analysis techniques and equipment.
• Knowledge of reliability calculation methods for semiconductors.
• Understanding of GD&T, ANSI standards and tolerance stack‑ups required.
• Demonstrated ability to work with cross‑functional teams.
• Excellent verbal and written communication skills.

This position is not eligible for visa sponsorship by the Company.

This position requires work on US Government contracts. Applicants must be a US Person (US citizen, permanent resident, asylee or refugee).

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex, national origin, age, military or veteran status, genetic information, or disability.