Principal Engineer Signal Integrity Power Integrity

## Principal Engineer Signal Integrity Power Integrity Apply locations:
USA
- Texas
- Richardson time type:
Full time posted on:
Posted Todayjob requisition :
JR-2600795
** About Global Foundries:
** Global Foundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, Global Foundries make possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit
** Introduction:
** We are seeking a highly experienced
** Principal Engineer, Signal Integrity & Power Integrity
** Leader with strong experience in signal integrity, power integrity, die-package-board co-design, and system-level electrical architecture. This role requires deep expertise in high-speed interfaces, power delivery networks, advanced packaging technologies, and electrical performance optimization across silicon, package, and board domains.
*
* Key Responsibilities:

**
* ** Lead SI/PI strategy
** for custom silicon products developed by MIPS covering industrial, automotive, AI, networking, and other end-equipment applications. Drive the overall signal integrity and power integrity engagement on these products and establish methodologies, design guidelines, and signoff criteria to ensure robust system performance and first-pass silicon success.
* ** Define electrical architecture and system-level requirements
** in alignment with product performance, power, cost, reliability, and manufacturability goals. Drive architecture definition for package power delivery networks, high-speed interfaces, board topologies, and channel implementations while serving as the technical authority for electrical design decisions.
* ** Drive die-package-board co-design and related engineering work
** on interface placement, IO planning, bump assignment, floorplan optimization, package routing, board stackup definition, and power delivery implementation to achieve optimal electrical performance across the complete system.
* ** Cross-collaboration and system-level leadership
** working closely with SoC Design, Package Design, Board/System Design, Validation, and customers to develop compelling and differentiated solutions. Strong understanding of electrical performance challenges, package and board level tradeoffs, compliance requirements, and a proven track record in driving technology and vendor engagements.
* ** Drive system-level analysis
** performing and guiding signal integrity (SI), power integrity (PI), electromagnetic (EM), channel compliance, and electrical performance simulations across die, package, and board environments. Drive signoff methodologies and design closure processes across multiple engineering disciplines.
* ** Validation and characterization leadership
** with the ability to define validation strategies and characterization requirements for new products. Support compliance testing, simulation-to-silicon correlation, silicon bring-up, and electrical root-cause analysis while driving resolution of product performance issues.
* ** Mentorship and leadership
** in providing technical guidance and mentorship to engineers across the hardware engineering organization. Lead technical initiatives, establish engineering best practices, align team direction with business and product priorities, and serve as the technical Subject Matter Expert (SME) for SI/PI and electrical co-design methodologies.
* ** Customer and vendor engagement leadership
** to drive technical alignment, discussions, and execution with customers, package vendors, PCB vendors, OSAT partners, and ecosystem suppliers. Drive customer discussions and align both internal product and technology roadmaps while supporting electrical architecture and system-level performance requirements.
* ** Stay current with the latest trends
** in signal integrity, power integrity, advanced packaging, chiplets, UCIe, power delivery architectures, AI/HPC platforms, and next-generation high-speed interconnect technologies. Drive design innovation,…