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HBM Physical Design Engineer - Lead Tape-Out & Signoff

Job in Richardson, Dallas County, Texas, 75080, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-08-08
Job specializations:
  • Engineering
    Electronics Engineer, Hardware Engineer, Engineering Design & Technologists
Salary/Wage Range or Industry Benchmark: 140000 - 210000 USD Yearly USD 140000.00 210000.00 YEAR
Job Description & How to Apply Below

Micron Technology, Inc. is seeking a seasoned physical design engineer to drive end-to-end HBM and memory-dominant die layouts from netlist to GDSII.

You will own floor planning, power planning, placement, CTS, routing, and signoff for high-density designs while collaborating across memory design, PHY, RTL, synthesis, DFT, SI, packaging and test teams. The role requires 7+ years of hands-on advanced-node physical design, proven tape-out experience on HBM/DRAM, and expert-level Cadence Innovus and

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