Circuit ​/ Memory Design Engineer | HBM - TPG

Req  Circuit / Memory Design Engineer | HBM - TPG

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization.

It aims to deliver the lowest power per bit solutions in the industry.

As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions.

In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve design quality and manufacturability. You will collaborate with cross‑functional partners to support tape‑out readiness and future technology scaling. This role offers hands‑on impact across the full semiconductor design flow.

• Contribute to new product opportunities by supporting overall circuit design, layout, and optimization for memory and logic or analog circuits.
• Perform parasitic modeling and support design validation, including reticle experiments and required tape‑out revisions.
• Oversee and manage the layout process, including floor‑planning, placement, and routing.
• Perform verification using modeling, simulation and AI assisted analysis with industry‑standard simulators.
• Collaborate across teams to drive standardization and shared design success.
• Partner with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to support accurate manufacturability.
• Proactively incorporate guidance from standards, computer‑aided design (CAD), modeling, and verification teams to improve design quality.

• Bachelor’s degree in Electrical Engineering or a related field, or equivalent practical experience.
• 4+ years of relevant experience with a Bachelor’s degree, or 2+ years with a Master’s degree.
• Extensive knowledge of CMOS circuit design and semiconductor device physics.
• Experience with schematic entry, Verilog, FastSPICE, and HSPICE simulations.
• Strong understanding of timing, area, power, and complexity trade‑offs in DRAM or mixed‑signal design.

• Strong verbal and written communication skills for conveying complex technical concepts.
• Self‑motivated, collaborative team player who thrives in diverse environments.
• Excellent problem‑solving and analytical skills, including scripting experience (Python, TCL, Perl).
• Prior register‑transfer level (RTL) design flow experience in DRAM or foundry processes.
• Experience with design for test (DFT) concepts or implementation at any level.

Semiconductor Design Engineer 3

Relocation Level: TBD

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