Senior Advanced Semiconductor Engineer

Senior Advanced Semiconductor Engineer (Finance)

As a MEMS Design and Integration Engineer, you will own the development and optimization of cutting-edge semiconductor technology nodes. You will work at the intersection of device design, process technology, electrical characterization, and yield engineering, tuning fabrication conditions to meet strict electrical and reliability targets. This position supports silicon-based microelectromechanical systems (MEMS) sensor technologies for medical, commercial, industrial, automotive, defense, and space applications.

This role combines innovative research with practical engineering applications, contributing to advancement of cutting-edge sensor technologies.

• MEMS Sensor Design Development: Develop sensor chip design for pressure, air flow, liquid flow, magnetic, chemical, and electrochemical sensing.
• Process Flow Definition: Develop, document, and optimize integrated front-end and back-end process flows for new technology nodes.
• Device Performance Optimization: Assist with electrical characterization of MEMS devices under development. Utilize knowledge of semiconductor device physics to drive performance, parametric Cpk improvements, and overall yield.
• Cross-Functional Leadership: Coordinate with specialized teams-including Lithography, Etch, Thin Films, CMP, and Metrology-to execute experiments and resolve integration issues.
• Data Analysis & Experimentation: Plan and execute Design of Experiments (DOE). Analyze yield data, identify root causes of parametric outliers, and define corrective actions.
• Technology Transfer: Support the scale-up and transfer of advanced technologies from R&D to High-Volume Manufacturing (HVM).
• Failure Analysis: Partner with reliability and failure analysis (FA) teams to diagnose electrical failures and validate device robustness.

YOU MUST HAVE

• Minimum B.S. in Electrical Engineering, Materials Science, Physics, or a related field (M.S. or Ph.D. preferred for advanced R&D).
• Minimum of 7 years of hands-on experience in semiconductor fabrication, process integration, device engineering, and device characterization. Experience with process integration and design, especially for MEMS pressure sensors, is a must.
• Deep understanding of semiconductor device physics, the interaction of various semiconductor unit processes, and device testing.
• Familiar with semiconductor fabrication processes (diffusion, implant, wet, photolithography, plasma, metal deposition, parametric testing, saw).
• Experience with process integration, especially for pressure sensors.

• Proficiency with statistical analysis and data mining tools (e.g., SPC, JMP, Yield Miner, or similar).
• Strong project management, interpersonal, and cross-functional leadership capabilities to align multiple engineering modules toward a common product goal.

Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. Person, which is defined as, a U.S. citizen, a U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status or have the ability to obtain an export authorization.

In addition to a performance-driven salary, cutting-edge work, and developing solutions side-by-side with dedicated experts in their fields, Honeywell employees are eligible for a comprehensive benefits package. This package includes employer-subsidized Medical, Dental, Vision, and Life Insurance;
Short-Term and Long-Term Disability; 401(k) match, Flexible Spending Accounts, Health Savings Accounts, EAP, and Educational Assistance;
Parental Leave, Paid Time Off (for vacation, personal business, sick time, and parental leave), and 12 Paid Holidays. For more information visit:
Benefits at Honeywell

The application period for the job is estimated to be 40 days from the job posting date; however, this may be shortened or extended depending on business needs and the availability of qualified candidates.
Posting Date
: 8/10/2026

Honeywell Technologies is a global, pure-play automation company with a legacy of innovating to help solve…