Intern - HBM Design Architect | MS or PhD Student

About the Team

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As an HBM Design Architect Intern, you will work alongside experienced architects and engineers to evaluate HBM and DRAM architecture concepts, develop analytical models, and investigate design tradeoffs affecting performance, power, thermal behavior, reliability, and manufacturability. This internship provides hands‑on experience in semiconductor architecture analysis while offering opportunities to leverage AI Assisted engineering workflows, Large Language Models (LLMs), and Generative AI technologies to support design exploration and engineering productivity.

• Analyze HBM and DRAM architecture tradeoffs related to timing, bandwidth, power, area, thermal performance, reliability, and design complexity using analytical, simulation, and AI Assisted methodologies.
• Develop first-order models, simulations, and data-analysis tools to compare design alternatives, identify key sensitivities, and support architecture pathfinding studies.
• Collaborate with architecture, circuit design, verification, layout, packaging, product, and system engineering teams to evaluate implementation feasibility and technology tradeoffs.
• Review simulation, experimental, and silicon data to perform root-cause analysis, validate assumptions, improve model accuracy, and develop evidence-based recommendations.
• Apply Large Language Models (LLMs), Generative AI, and AI Assisted engineering workflows to enhance engineering analysis, technical research, and productivity while documenting and presenting findings to multi-functional teams.

• Currently pursuing a Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related field and returning to the degree program following completion of the internship.
• Strong academic foundation in at least two of the following areas: CMOS circuits, digital or mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, power delivery, signal integrity, or advanced packaging.
• Experience using engineering analysis, modeling, or simulation tools through graduate research, coursework, laboratory projects, or internships.
• Demonstrated ability to define assumptions, perform technical analysis, evaluate results, and communicate evidence-based conclusions.
• Strong problem-solving, analytical, written communication, and verbal communication skills.

• Graduate research, internship, thesis, dissertation, or project experience related to HBM, DRAM, SRAM, memory controllers, high-speed interfaces, semiconductor architecture, or 3D integrated circuit technologies.
• Experience with transistor-level simulation or schematic-entry tools such as HSPICE, Fine Sim, Spectre, or similar platforms.
• Understanding of timing, power, area, performance, thermal, and reliability tradeoffs in advanced semiconductor products.
• Familiarity with AI workloads and the impact of memory bandwidth, latency, capacity, power, and thermal characteristics on system performance.
• Experience using data analytics, Large Language Models (LLMs), Generative AI, or AI Assisted engineering workflows to improve technical insight, design exploration, or productivity.

• Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family…