Design Engineer, HBM Architecture

Job Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products.

The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production. We are seeking a highly motivated HBM Datapath Architect to architect, design, and optimize high‑speed data paths for next‑generation High Bandwidth Memory (HBM) products! This role focuses on logic‑die and core‑die datapath circuitry, enabling industry‑leading bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions.

The ideal candidate will work closely with design, PHY, ECC, verification, layout, and system teams to deliver robust datapath designs from concept through silicon bring‑up and production.

• Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic
• Develop high‑speed, low‑latency datapath circuits supporting multi‑channel HBM architectures and wide internal buses
• Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes
• Design and integrate data reliability features, including parity, ECC hooks, lane redundancy, and remapping mechanisms
• Collaborate with multi‑functional teams to translate specifications into robust micro‑architectures
• Collaborate with PHY, DFT, verification, and layout teams to ensure accurate functionality, testability, and manufacturability
• Drive schematic‑level and RTL‑level datapath implementations, including clocking, gating, and reset strategies
• Contribute to design reviews, documentation, and technical mentoring across HBM programs
• Demonstrate proficiency in using AI‑enabled tools (e.g., Microsoft Copilot and other approved AI solutions) to improve productivity, streamline workflows, analyze information, and accelerate problem solving

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 7+ years of relevant industry experience, or a Master’s degree with 5+ years of relevant industry experience
• 3 + years of experience in high‑speed digital datapath design (memory, Ser Des, or SoC datapath)
• 3+ years of hands‑on experience with digital schematic build, RTL, or mixed‑signal datapath implementations

• Strong understanding of HBM/DRAM architectures, including read/write data flow, timing, and multi‑channel operation
• Working knowledge of layout and floor planning considerations for high‑speed datapath
• Experience with static timing analysis (STA) and timing‑closure methodologies
• Familiarity with advanced process‑node challenges related to signal integrity, skew control, and power optimization

• Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave
• Micron offers a robust paid time‑off program and paid holidays
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on

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