Senior Advanced MEMS Design Engineer - Integration

This position supports silicon-based microelectromechanical systems (MEMS) sensor technologies for medical, commercial, industrial, automotive, defense, and space applications. This role combines innovative research with practical engineering applications, contributing to advancement of cutting-edge sensor technologies.

As a Senior Advanced MEMS Design and Integration Engineer, you will own the development and optimization of cutting-edge semiconductor technology nodes. You will work at the intersection of device design, process technology, electrical characterization, and yield engineering, tuning fabrication conditions to meet strict electrical and reliability targets.

You will report directly to our Senior Semi conduct Engineering Manager, and you’ll work out of our Richardson, TX location on a Hybrid work schedule.

• MEMS Sensor Design and Development:
  Develop sensor chip design for pressure, air flow, liquid flow, magnetic, chemical, and electrochemical sensing.
• Process Flow Definition:
  Develop, document, and optimize integrated front-end and back-end process flows for new technology nodes.
• Device Performance Optimization:
  Assist with electrical characterization of MEMS devices under development. Utilize knowledge of semiconductor device physics to drive performance, parametric Cpk improvements, and overall yield.
• Cross-Functional Leadership:
  Coordinate with specialized teams including Lithography, Etch, Thin Films, CMP, and Metrology-to execute experiments and resolve integration issues.
• Data Analysis & Experimentation:
  Plan and execute Design of Experiments (DOE). Analyze yield data, identify root causes of parametric outliers, and define corrective actions.
• Technology Transfer:
  Support the scale-up and transfer of advanced technologies from R&D to High-Volume Manufacturing (HVM).
• Failure Analysis:
  Partner with reliability and failure analysis (FA) teams to diagnose electrical failures and validate device robustness.

• B.S. in Electrical Engineering, Materials Science, Physics, Engineering Physics, or a related field (M.S. or Ph.D. preferred for advanced R&D).
• 7+ years of hands-on experience in semiconductor fabrication, process integration, device engineering, MEMS development, and device characterization.
• 7+ years of experience with process integration and design, especially for MEMS pressure sensors.
• 4+ years of experience in statistical analysis and data mining tools (Mini Tab, SPC, JMP, Python, etc.).
• 5+ years of experience with semiconductor fabrication processes (diffusion, implant, wet, photolithography, plasma, metal deposition, parametric testing, saw).

• Deep understanding of semiconductor device physics, the interaction of various semiconductor unit processes, and device testing.
• Strong project management, interpersonal, and cross-functional leadership capabilities to align multiple engineering modules toward a common product goal.

In addition to a competitive salary, leading-edge work, and developing solutions side-by-side with dedicated experts in their fields, Honeywell employees are eligible for a comprehensive benefits package. This package includes employer subsidized Medical, Dental, Vision, and Life Insurance;
Short-Term and Long-Term Disability; 401(k) match, Flexible Spending Accounts, Health Savings Accounts, EAP, and Educational Assistance;
Parental Leave, Paid Time Off (for vacation, personal business, sick time, and parental leave), and 12 Paid Holidays. Learn more ()

The application period for the job is estimated to be 40 days from the job posting date; however, this may be shortened or extended depending on business needs and the availability of qualified candidates. Job Posted:
September 15,…