Lead Layout Architect -Gen HBM Analog & Mixed-Signal
Listed on 2026-10-06
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Engineering
Electronics Engineer, Hardware Engineer -
Design & Architecture
Micron Technology, Inc. is seeking a Principal Layout Designer for next‑generation HBM architecture.
You will drive analog and mixed‑signal layout for 3D‑stacked memories, collaborating with architecture, design and packaging teams to prove feasibility and identify optimizations. Responsibilities include layout for critical blocks, floor planning, placement and routing, LVS/DRC verification, and thorough documentation.
We invite applications for the Lead Layout Architect for Next-Gen HBM Analog & Mixed-Signal position located in Richardson, TX, United States.
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This posting is for the Lead Layout Architect for Next-Gen HBM Analog & Mixed-Signal role at Micron Technology, Inc, based in Richardson, TX, United States.
We are looking to fill the Lead Layout Architect for Next-Gen HBM Analog & Mixed-Signal position at Micron Technology, Inc in Richardson, TX, United States.
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