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Process Development Engineer

Job in Richardson, Dallas County, Texas, 75080, USA
Listing for: Qorvo
Full Time position
Listed on 2026-06-19
Job specializations:
  • Manufacturing / Production
    Manufacturing Engineer, Quality Engineering, Electrical Engineering
  • Engineering
    Manufacturing Engineer, Quality Engineering, Electrical Engineering, Process Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit to learn how our innovative team is helping connect, protect and power our planet.

Responsibilities
  • Support both volume production as well as New Product Introduction (NPI) production.
  • Support manufacturing for surface mount electronics (SMT), Flip Chip Attach and Die Attach.
  • Evaluate new equipments, processes, and materials.
  • Generating post build/DFM report.
  • Take 5S/process improvement initiatives.
  • Monitor Product Yields daily and work with appropriate engineers to take corrective actions when trends indicate equipment and/or process issues.
  • Work with Fixturing vendors to support Die assembly in the factory.
  • Works closely with Operators and Technicians and train them on basic operation of equipment, including screen printer, SPI machine, SMT machine, Datacon, Esec, reflow oven and AOI machine.
  • Generate process documentation.
Qualifications
  • Bachelor's degree in Industrial, Mechanical or Electrical engineering considered with internship experience
  • Postgraduate Degree accepted in lieu of industry experience
  • Strong Semiconductor Assembly experience with High density of fine pitch components – BGA, LGA, QFN, 0201, 01005 components, etc
  • 2+ years of experience in a mid to high-volume manufacturing environment
  • Experience with IPC-A-610 standard, SPC techniques and Lean practices is required
  • Should have experience working with solder paste and conductive epoxy.
  • Should have experience working on vaccum and convection reflow processes.
Desired Skills
  • Advanced problem solving abilities
  • Initiative to delve into processes, and understand how and why they work
  • Experience in a hands on environment (factory, lab)
  • Ability to work independently, as well as in a team environment.
  • Must have good communication and computer skills
  • Programming ability using Labview, Python, or other
  • Lean manufacturing experience is a plus
  • Experience in a manufacturing environment.

This position is not eligible for visa sponsorship by the Company.

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