Technical Production Manager
Job in
Richardson, Dallas County, Texas, 75080, USA
Listed on 2026-07-18
Listing for:
CCA Professional Recruiting
Full Time
position Listed on 2026-07-18
Job specializations:
-
Manufacturing / Production
Production QC/QA, Production Manager, Quality Engineering, Lean Manufacturing / Six Sigma
Job Description & How to Apply Below
Technical Production Manager – Semiconductor Backend
Job Type: Full-Time | Exempt
Salary: $70,000 – $90,000 per year (Based on Experience)
About the RoleWe are seeking an experienced Technical Production Manager to lead our semiconductor backend manufacturing operations. This position is responsible for overseeing in-house wafer probe, wafer dicing/saw operations, and coordinating outsourced assembly and final test activities with subcontract manufacturing partners.
The ideal candidate will bring strong technical expertise in semiconductor backend processes, proven leadership experience, and the ability to drive production efficiency, quality, and continuous improvement in a fast‑paced manufacturing environment.
Key Responsibilities- Lead daily backend semiconductor manufacturing operations, including wafer probe, wafer dicing, and wafer saw processes.
- Supervise and mentor a team of approximately 8–12 technicians and production personnel across multiple shifts.
- Manage production schedules, work orders, traveler flow, and material movement between internal manufacturing and subcontract partners.
- Coordinate outsourced assembly and final test operations to ensure on‑time delivery, quality, and yield performance.
- Monitor subcontractor performance, including production yields, quality metrics, and delivery commitments.
- Investigate and resolve process excursions, yield losses, and production issues with internal engineering teams and external manufacturing partners.
- Support New Product Introduction (NPI) by coordinating backend process qualifications and subcontract readiness.
- Ensure compliance with cleanroom protocols, ESD requirements, ISO quality standards, and company procedures.
- Drive continuous improvement initiatives utilizing Lean Manufacturing, 5S, Statistical Process Control (SPC), and yield analysis.
- Develop cross‑training plans to improve workforce flexibility and production coverage.
- Collaborate with Engineering, Planning, Supply Chain, and Quality teams to ensure smooth production execution.
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, or equivalent industry experience.
- Minimum of 7 years of semiconductor backend manufacturing experience involving wafer probe, wafer saw, assembly, or final test.
- At least 3 years of supervisory or production leadership experience.
- Strong experience managing wafer probe and dicing operations.
- Experience coordinating outsourced semiconductor assembly and test operations.
- Knowledge of Statistical Process Control (SPC), yield analysis, and semiconductor manufacturing processes.
- Experience using MES and/or ERP systems.
- Strong leadership, communication, and problem‑solving skills.
- Ability to manage multiple priorities while maintaining production schedules and quality standards.
- Experience in a high‑mix, low‑volume semiconductor manufacturing environment.
- Hands‑on experience managing subcontract semiconductor assembly and test suppliers.
- Knowledge of Lean Manufacturing, 5S, Continuous Improvement, and process optimization methodologies.
- Strong analytical skills with the ability to identify and resolve manufacturing process issues.
- Experience supporting New Product Introduction (NPI) and production transfers.
- Combination of office and semiconductor cleanroom environments.
- Frequent collaboration with engineering, planning, quality, and subcontract manufacturing partners.
- Occasional travel to subcontract manufacturing facilities.
- Flexibility to support alternate shifts or international supplier schedules when required.
- Ability to work in both office and manufacturing environments.
- Frequently stand, walk, bend, and handle manufacturing materials.
- Ability to lift up to 50 pounds occasionally.
- Must be able to work in a cleanroom environment while following ESD and safety protocols.
- Opportunity to lead critical semiconductor backend manufacturing operations.
- Work with cutting‑edge semiconductor technologies.
- Collaborative engineering and manufacturing environment.
- Competitive salary and comprehensive benefits.
- Career growth opportunities within a growing semiconductor organization.
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