Process Integration, Yield and Defect Reduction Engineering Manager

Job Details:

Job Description:

Job Description

Note:

This role requires regular onsite presence to fulfill essential job responsibilities. The New Mexico Silicon Manufacturing Integration team is seeking a highly motivated engineering professional with a strong technical background to grow into a Process Integration, Yield, and Defect Reduction Engineering Manager role. In this position, you will collaborate closely with Advanced Packaging High Volume Manufacturing (HVM) technical and factory operations teams to support the transfer, ramp, and sustaining of advanced packaging solutions while ensuring delivery against foundry customer commitments.

• Develop and execute a comprehensive defect reduction roadmap to improve yield and product quality.
• Design and implement defect scan strategies, quick‑turn analyses, and parametric monitoring systems.
• Leverage Win It Inline methodologies to drive continuous process improvement while meeting quality and reliability objectives.
• Lead a team of process integration, yield, and defect reduction engineers in solving complex manufacturing challenges.
• Collaborate with design, materials, product engineering, characterization, process development, and High Volume Manufacturing (HVM) teams to optimize manufacturing performance.
• Develop scalable and cost‑effective manufacturing solutions for advanced packaging technologies.
• Build and maintain inline metrics dashboards for critical process modules and manufacturing parameters.

• High level of technical contributions with a proven history of technology development, technical problem solving, and technology transfer through the creation of innovative solutions that demonstrate creativity and out‑of‑the‑box thinking.
• Ability to work effectively across organizational boundaries, including Process Engineering, Yield Engineering, and Product Engineering.
• Excellent written and verbal communication skills.
• Strong stakeholder management and interpersonal skills.
• Demonstrated ability to lead and influence others without formal authority.
• Ability to think and operate independently while effectively managing multiple competing priorities.
• Position is not eligible for immigration sponsorship.

Minimum Qualifications:

• Master's or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical discipline.
• 5+ years of relevant semiconductor manufacturing or advanced packaging experience.
• Demonstrated track record of technology development and technology transfer.
• Demonstrated ability to solve complex technical problems through innovative engineering approaches.
• High levels of technical contribution throughout the product development lifecycle.

• 3+ years of yield analysis and defect reduction methodologies.
• 3+ years of Failure Mode and Effects Analysis (FMEA).
• 3+ years developing inline monitoring systems and manufacturing dashboards.
• Deep understanding of integrated semiconductor process flows and process interactions.
• Strong knowledge of defect metrology tools and capabilities.

Experienced Hire – Shift 1 (United States of America). Primary

Location:

US, New Mexico, Albuquerque.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Annual Salary Range for jobs which could be performed in the US: $‑ USD.

This role will require an on‑site presence.