Advanced Packaging Metro Module Engineer

Intel Corporation is a global leader in technology innovation, dedicated to creating world‑changing technology that enriches the lives of every person on earth. This Module Engineer position supports the development and ramp‑up of high‑volume manufacturing processes for next‑generation advanced packaging technologies such as FOVEROS‑S and EMIB.

• Oversee high‑volume manufacturing equipment and processes that support advanced integrated circuit production.
• Conduct tests and measurements to maintain critical dimensions and minimize defectivity within the production line.
• Implement equipment modifications to enhance production efficiency, optimize manufacturing techniques, and meet safety, quality, and cost objectives.
• Manage maintenance, repairs, and upgrades for equipment and associated module components to ensure consistent operational performance.
• Drive continuous improvement initiatives focused on safety, quality, cost efficiency, yield, and defect reduction.
• Collaborate with equipment suppliers to resolve technical challenges and implement innovative solutions.
• Lead installation, conversion, and qualification of equipment during factory ramps, ensuring tools are installed safely, on schedule, and meet quality and matching criteria.
• Develop and refine systems for excursion prevention and discrepant material detection to maintain equipment and process reliability.
• Facilitate technology transfer to global manufacturing sites through training, audits, and support for installation and qualification processes.

Minimum Qualifications:

• Bachelor's or BS degree in a STEM-related field, or equivalent education.
• Minimum of 4 years of experience with a Bachelor's degree, 3 years with a Master's degree, or no experience required for a PhD.
• Experience in equipment monitoring, process characterization, manufacturing process improvement, and semiconductor equipment.
• Experience in manufacturing process change and optical characterization.

Preferred Qualifications:

• Understanding and hands‑on experience with metrology fundamentals, tool matching/calibration, and development.
• Experience with process analytical metrology, packaging processes, and process development.
• Experience in experimental design and its application to tool matching, qualification, and process optimization.
• Familiarity with semiconductor process flows, particularly advanced packaging, and metrology assessment based on process requirements.
• Experience in project management and leading task forces from problem identification to resolution.
• Experience with equipment automation development and collaboration with equipment suppliers.

Job Type: Experienced Hire.

Shift: Shift
1. Primary

Location:

Albuquerque, New Mexico, USA. Requires regular on‑site presence. Not eligible for Intel immigration sponsorship.

Annual Salary Range: $–$ USD.

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.