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Hardware Engineer; PCB, Circuit Design, Industrialization, Wireless, ECAD Assistanc

Job in City of Rochester, Rochester, Monroe County, New York, 14602, USA
Listing for: GE Vernova
Full Time position
Listed on 2026-07-14
Job specializations:
  • Engineering
    Electrical Engineering, Electronics Engineer, Systems Engineer, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 80000 USD Yearly USD 80000.00 YEAR
Job Description & How to Apply Below
Position: Hardware Engineer (PCB, Circuit Design, Industrialization, Wireless, ECAD) Relocation Assistanc[...]
Location: City of Rochester

Job Description Summary

Sign On Bonus

Relocation Assistance

As a Hardware Engineer for Critical Infrastructure Communications (CIC) at GE Grid Solutions, you will be responsible for designing industry-leading solutions for industrial grade wired and wireless communications products. CIC is seeking an experienced Electrical Engineer who is team-oriented and can thrive in the critical path of multiple projects. A successful candidate will have practical circuit-level design and troubleshooting experience in a laboratory environment.

The ideal candidate should have working knowledge at the product level, as the candidate will be responsible for various aspects of the design throughout the product lifecycle including production. The successful candidate must also be capable of working collaboratively with peers in an international engineering organization to ensure design goals are met and critical trade-offs are identified. This role requires strong written and verbal communication skills to accurately convey complex solutions to audiences of varying technical expertise on a cross‑functional team spanning multiple sites.

Roles and Responsibilities
  • Complete schematic and PCB layouts containing digital, analog, and RF circuitry.
  • Create new components and maintain ECAD component database.
  • Contribute to the hardware development of industrial‑grade communications equipment by applying principles and techniques of electrical engineering, circuit design, and analysis.
  • Complete the analysis and design of digital and mixed‑signal communications circuitry including MCU, CPU, flash, Ethernet, and USB considering EMC, thermal, mechanical, and electrical safety constraints.
  • Create production documentation including top‑level bills of material and label specifications.
  • Work onsite with a team of Electrical and Embedded Firmware Engineers in an office/lab environment.
  • Perform and document the results of circuit‑level validation testing.
  • Ensure compliance to product safety, emissions, and performance standards supporting 3rd‑party certification labs as needed.
  • Support and troubleshoot existing product design deficiencies reported by customers and manufacturing.
  • Perform MTBF and reliability data for the individual product subsystems.
  • Provide support and specifications to Manufacturing and Test Engineering teams.
Required Qualifications
  • Bachelor’s degree in Engineering
  • 3 years of prior hardware design experience
  • 3 years of experience with circuit design and ECAD
  • 2‑3 years of experience with wireless or embedded development
Desired Characteristics
  • Experience with Altium Designer
  • Familiarity with emissions standards including FCC, IC, ETSI, Anatel, or ACMA
  • Experience with communication interfaces and protocols (ex. Ethernet, USB, I2C, SPI, etc).
  • Familiarity with safety standards including EN62368‑1 and EN6095‑1
  • Proven knowledge of EMC and environmental standards required for CE Mark certification of telecommunication products
  • Ability to multi‑task, prioritize tasks, and quickly adapt in a fast‑paced engineering environment
  • Ability to solder/desolder surface mount and through‑hole components using a soldering station and heat gun
  • Experience using signal generators, network analyzers, and spectrum analyzers
  • Ability to work collaboratively with an international development team
  • Familiarity with MCU, SoC, and modem integration for 4G LTE, 5G, and WiFi technologies
  • Demonstrated ability to work autonomously and collaborate with a team to resolve technical issues
  • Demonstrated ability to produce Hardware Design Specifications and other relevant design documentation
  • Strong interpersonal and leadership skills
Benefits and Compensation

Pay range: $80,000.00 to $, with a geographic differential of 110%, 120%, or 130% in certain areas.

Bonus eligibility: discretionary annual bonus.

Medical, dental, vision, and prescription drug coverage.

Health Coach: 24/7 nurse‑based resource.

Employee Assistance Program: 24/7 confidential assessment, counseling and referral services.

Retirement: GE Vernova Retirement Savings Plan, a tax‑advantaged 401(k) savings opportunity with company matching contributions and company retirement contributions.

Other benefits: tuition assistance, adoption assistance, paid parental leave, disability benefits, life insurance, 12 paid holidays, and permissive time off.

GE Vernova is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, protected veteran status or other characteristics protected by law.

GE Vernova will only employ those who are legally authorized to work in the United States for this opening. Any offer of employment is conditioned upon the successful completion of a drug screen (as applicable).

Relocation Assistance Provided:
Yes

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