Precision Electromechanical Assembler - Substrate Attach; 2nd shift

RELOCATION ASSISTANCE:
No relocation assistance available

CLEARANCE REQUIRED FOR START:
No

CLEARANCE TYPE:
Secret

TRAVEL:
Yes, 10% of the Time

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. We have a wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies. Our differentiated battle management and cyber solutions deliver timely, mission-enabling information and provide superior situational awareness and understanding to protect the U.S. and its global allies.

Northrop Grumman Mission Systems is looking for you to join our Microelectronics Team as a Precision Electromechanical Assembler 2 (2nd shift) in our Sub-Attach Work center for Second Shift based out of Rolling Meadows, IL.

• Electromechanical Performance:
  Perform a variety of operations to assemble / solder / integrate precision electromechanical products working from strict adherence to Northrop Grumman's Electronic Work Instructions (EWI's), detailed mechanical drawings, and verbal instructions.
• ESD and cleanliness control:
  Apply Northrop Grumman ESD practices and follow cleanroom/handling procedures to prevent contamination, corrosion, or surface damage that can cause poor adhesion.
• Documentation & traceability:
  Complete work instructions and records accurately (equipment , program/recipe, operator, lot numbers, run parameters, yields/scrap counts).
• Equipment readiness & maintenance:
  Support setup/Preventative Maintenance (PM) activities for die attach equipment; keep nozzles/dispense tools and fixtures clean; report tool alarms or drift.
• Safety & material compliance:
  Follow Northrop Grumman's EH&S chemical handling/Safety Data Sheet (SDS) requirements, Personal Protective Equipment (PPE), and safety procedures; ensure proper waste handling and storage of attach materials.
• Die/substrate preparation:
  Clean and stage dies and substrates; confirm part numbers, lot traceability, die orientation, and die placement references.
• Adhesive/attach material handling:
  Dispense and manage die-attach materials (adhesives/epoxies/solders as applicable) using approved recipes for dispense volume, bead geometry, and mix/usage rules.
• Die attach operation (core task):
  Place dies accurately onto substrates/packages using vision alignment/tooling; perform the required attach step(s) (e.g., dispense + placement, then cure/reflow where required).
• Profile and parameter control:
  Run and maintain correct process parameters (temperature/time/pressure, cure profile, reflow settings, dispense settings) and verify they stay within specification.
• Placement accuracy & tolerance compliance:
  Ensure die placement meets tolerance requirements (center alignment, rotation/orientation, edge clearance) and verify no die “float” or misregistration occurs during curing.
• Coverage and void management:
  Monitor die-attach coverage and look for issues such as voids, gaps, edge lifting, or insufficient wetting/adhesion risk.
• In-process inspection:
  Perform visual and/or metrology checks as required (alignment checks, attach appearance, pick/place quality, any die shift measurements).
• Defect detection & basic troubleshooting:
  Identify common causes of failure (contamination, improper cure, dispense inconsistency, incorrect substrate condition) and escalation with supporting evidence.
• Rework/scrap support:
  Follow approved rework procedures if applicable; document disposition of defects and support root-cause actions for recurring issues.
• Cross-functional coordination:
  Communicate with engineering/quality/production teams on holds, escapes, yield impacts, and process changes; participate in continuous improvement.
• Specialize…