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Photomask Dry Etch Engineer

Job in Round Rock, Williamson County, Texas, 78682, USA
Listing for: Tekscend Photomask Corp.
Full Time position
Listed on 2026-09-18
Job specializations:
  • Engineering
    Process Engineer, Quality Engineering
Salary/Wage Range or Industry Benchmark: 110000 - 150000 USD Yearly USD 110000.00 150000.00 YEAR
Job Description & How to Apply Below

Job description:

The Dry Etch Process Engineer will serve as a key technical contributor supporting plasma-based dry etch processes for photomask manufacturing. As part of the etch engineering team, this role is responsible for daily process sustaining, defining equipment requirements, optimizing plasma etch performance, and driving the introduction of new dry etch technologies into production. The engineer will work closely with operations and technical development teams to ensure robust process integration and to continuously improve yield, cycle time, and overall product quality.

Education/Experience

Requirements
  • Bachelor's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, Physics, Chemistry, or a related engineering discipline.
  • 3+ years of Dry Etch Process Engineering experience in high‑volume semiconductor manufacturing or new grad with advanced degree and semiconductor-related thesis work.
  • Strong troubleshooting capability, including root‑cause analysis (5 Whys, Model‑Based Problem Solving) and implementation of corrective and preventive actions (8D).
  • Experience in process development and continuous improvement methodologies, such as DOE, statistical data analysis, APC, recipe management, SPC, and OCAP creation.
  • Demonstrated success in defect‑reduction, CD‑variability‑reduction, and yield‑improvement initiatives.
  • Hands‑on tool ownership experience, including equipment troubleshooting, preventive maintenance optimization, FMEA, and FDC utilization.
  • Proficient in data analysis using tools such as JMP and Excel, with basic scripting or coding skills (VBA, JSL, Python, SQL).
  • Basic familiarity with surface characterization techniques (e.g., SEM/EDX, AFM/profilometry, ToF-SIMs, XPS, etc.): when to use what technique and how to interpret the data.
  • Familiarity with project management tools (e.g., Gantt charts) and the ability to manage multiple priorities simultaneously.
  • Excellent verbal and written communication skills, with the ability to interface effectively with personnel at all organizational levels-from equipment operators to senior leadership.
  • A self‑starter with strong attention to detail, solid organizational skills, and a collaborative mindset.
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