Lead Optical Packaging Engineer

Are you looking to join a team that influences the future in optics and more? Are you seeking an opportunity to take on interesting tasks and challenging projects? Each of our team members brings a unique view and skill set to every project we do, and we pride ourselves in being the brightest minds in optics. GPD Optoelectronics is seeking an accomplished technical lead engineer with a diverse skill set to join our team.

As the Lead Optical Packaging Engineer, you will oversee developing advanced packaging solutions including package design, material selections, fabrication processing, qualification, and documentation. You’ll work closely with design engineers, process engineers, supply chain, operations technicians, facilities, and outside consultants. This full‑time, exempt position will report to the COO and will be located at our Salem, NH facility. Preference will be given to candidates currently located within commutable distance to Salem, NH.

• Perform all aspects of package design and verification through the NPI and engineering change process to deliver robust, manufacturable solutions. This will be achieved through full understanding of product performance, material implications, project costs and design for manufacture.
• Develop and document manufacturing techniques, materials, tools and processes related to backend photodiode assembly.
• Perform analyses and select techniques to solve problems and enhance product yield and process flows.
• Establish high-yielding, cost-effective processes based on product need and customer requirements.
• Develop and execute Design of Experiments (DOE) for process optimization utilizing appropriate statistical analysis.
• Evaluate and validate process and design alternatives based on product manufacturability.
• Perform technical leadership to a manufacturing engineer to drive a new product or process into manufacturing.
• Provide processes that are robust and repeatable against product specifications and that support the quoted cost.
• Lead the design and manufacturing team in the direction for improving and streamlining existing processes for increased package assembly quality and reduced assembly time.
• Mentor junior staff.
• Other duties as assigned by your manager.

• BS in mechanical engineering, material science, or closely related technical discipline with at least 8 years of industrial experience in semiconductor or photonics die packaging.
• Fluent with material properties, packaging techniques, and manufacturing disciplines including die attach methods, wire bonding, flip‑chip die attach, seam seal, laser mark, and related qualification techniques.
• Demonstrated experience of working with diverse engineering disciplines.
• Strong manufacturing experience which ensures high yield along with controlled process.

• MSME with 6+ years of direct semiconductor or photonics die packaging experience.
• 5 years plus of technical leadership experience in cross‑functional teams.
• Design for Six Sigma practices including Root Cause Analysis, Design of Experiments, etc.
• General awareness of FEAbased analysis techniques as related to photonics and PIC package designs would be a distinct advantage.

• Able to lift up to 20 lbs.
• Travel may be required, likely less than 10%.

GPD provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation and training.

At GPD Optoelectronics, we believe that by operating with integrity and trust we drive constant organizational improvement, which strengthens our relationships with our employees and customers. Customer success remains our highest priority, so we strive to deliver high‑quality products on time, and provide unparalleled service, responsiveness, and collaboration. Founded in 1973 as Germanium Power Devices Corp, we began by making high‑quality germanium transistors.

Since the early 1980’s we have earned our place as a trusted manufacturer of both germanium and indium gallium arsenide photodiodes. We are located in Salem, NH.