Assembly - Die Attach

Due to EXTENSIVE growth, we are currently looking for folks that share our passion to reveal the invisible!

Assembly Technician – Die Attach (Optoelectronic Manufacturing)

The Assembly Technician – Die Attach is responsible for precision attachment of chips / die used in optoelectronic products within our cleanroom manufacturing environment. This role supports production operations by performing manual and automated die attach processes using epoxy and/or eutectic bonding methods, in accordance with applicable MILSTD
883 workmanship and process requirements. The Assembly Technician works within a production team reporting to Operations, while collaborating closely with Engineering and Quality to ensure robust, repeatable processes and high reliability assemblies.

This full-time, non-exempt role will report to the Director of Operations and is located at our Salem, NH Facility.

Key Responsibilities:

Die Attach & Assembly

• Perform die attach of chips to TOcan headers and / or ceramic substrates using manual and automated epoxy dispense systems and/or eutectic bonding processes
• Prep materials, load, set up, and operate die attach equipment per approved work instructions, travelers, and process specifications
• Accurately align die within specified positional and rotational tolerances to ensure proper device performance using both manual and automated pick-and-place (Air-Vac, vac- pen, etc.) methods
• Adjust process parameters and techniques, within documented guidelines, to achieve intended bonding results

Inspection, Quality & Process Control

• Conduct detailed visual inspection of die attach operations under microscope to MILSTD
  883 criteria
• Verify bond coverage, placement accuracy, cleanliness, and overall workmanship
• Identify, document, and escalate nonconformances or process deviations
• Support engineering builds, qualification activities, and rootcause investigations as required

Material Handling & Packaging

• Handle sensitive optoelectronic components using proper ESD, cleanliness, and contamination (FOD) control practices
• Maintain material traceability and part identification throughout the manufacturing process
• Package assemblies per work instructions and cleanliness standards

Collaboration & Production Support

• Work effectively in a teambased production environment to meet schedule, yield, and quality objectives
• Partner closely with Engineering and Quality to implement process improvements and corrective actions

• Maintain accurate documentation, travelers, and production records using our ERP system and shop floor interface

Qualifications & Skills

• High School / GED or Technical trade school
• 2-3 years’ experience in a manufacturing or technical environment.
• Previous experience in microelectronics or optoelectronic assembly preferred (die attach experience highly desired)
• Familiarity with epoxy dispense systems, eutectic bonding, and regulated manufacturing environments
• Strong attention to detail, steady manual dexterity, and ability to work under a microscope
• Demonstrated ability to follow detailed instructions while exercising sound judgment in process execution

Misc.

• This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs.
  • These activities are performed in a clean room environment which is temperature and humidity controlled.
  • This position requires you to wear complete fab attire for an entire shift and meet all safety and cleanroom requirements which can include:

Hand Hygiene, Personal Item Removal, Gowning Area Preparation,

Order of Gowning, Shoe Covers, Hair Covers, Face Masks, Coveralls/Gowns,

Gloves, Additional Garments, Final Inspection and maintaining proper protocols.

GPD provides equal employment opportunities to all employees and…