Mechanical Engineer

Connecting and Protecting People, Microwave Products Group (MPG) is a leading global provider of mission-critical engineered electronic components and subsystems comprised of five business units in six manufacturing locations. Our brand names are recognized globally including: BSC Filters, York, UK;
Criteria Labs, Austin, TX;
Dow-Key Microwave, Ventura, CA;
Pole/Zero, West Chester, OH;
Espy, Austin, TX; and K&L Microwave, Salisbury, Maryland and Dominican Republic.

Our expertise is the design and manufacture of communications-based specialty products – engineered components and subsystems – for demanding military, space, commercial aerospace/industrial, and telecom infrastructure applications where function and reliability are crucial.

POSITION OVERVIEW :

Primarily responsible for the design efforts for electro-mechanical packaging for radio frequency (RF) devices. Position utilizes CAD to design, evaluate, and solve packaging, thermal, and stress challenges related to the assembly of electronic hardware within standard and custom designed enclosures.

Job Duties /Responsibilities:

Design high performance mechanical assemblies and support production of designs by production teams

Design mechanical structures that house circuit card assemblies, electronic components, subassemblies, etc.

Conduct the thermal, mechanical stress, and vibration analysis of electro-mechanical enclosures, heat exchange mechanisms, and printed circuit boards used on airborne, maritime, and ground-mobile RF equipment

Conduct air flow calculations to determine mass flow (lb/min), volume flow, velocity, pressure drop, etc., with ambient, inlet, and outlet variables such as temperature, altitude, and pressure

Designs and develops PCB’s and PCBA’s IAW IPC-2221.Produce and maintain the documentation related to the mechanical aspects of a design

Develop detail drawings and Bills of Materials (BOM) for assigned product designs

Incorporate engineering change orders

Support research and investigation to determine the root cause analysis of mechanical failures

Support new program proposal efforts including technical interchange with potential customers

Support and aid in the development of multiple mechanical designers

Knowledge, Skills, and Abilities:

Experience in thermal and structural analysis, and electro-mechanical packaging required, NASTRAN is preferred

Experience using thermal and stress analysis software is required

AutoDesk Inventor and AutoCAD preferred

Experience with PCB layout software.

RF Microwave experience and experience with passive and active circuitry.

General knowledge of MIL-STD testing is required

Knowledge of Airborne Mil environments preferred

Knowledge of thermal and mechanical test equipment preferred

Knowledge of IPC standards preferred

Must have excellent written and verbal skills

Must be able to effectively and efficiently communicate with other departments, including manufacturing, quality and management

Must be able to communicate effectively with the customer (both internal and external), both in verbal and written formats

Requirements:

Must be a US Person (US Citizen or permanent resident – green card holder)
Bachelor’s degree in mechanical engineering from an accredited four-year college or university and 2+ years of relevant experience OR MS in mechanical engineering from an accredited college or university and 3+ years of relevant experience

Experience with 3D CAD software required

Experience with military standards and specifications required

Experience with military electro-mechanical enclosure designs highly desired ISO and lean manufacturing experience highly desired

Ability to obtain a DoD security clearance

Works from minimal documentation, written or verbal instructions, schematics, rough sketches, diagrams,…