Temp Electronic Assembler​/BGA Repair Technician

Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest‑growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina Corporation provides end‑to‑end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors.

Sanmina Corporation has facilities strategically located in key regions throughout the world.

Job Purpose:

The Senior Electronic Assembler/BGA Repair Technician will assemble Circuit Card Assemblies using Bill of Materials, drawings and work instructions. The position requires advanced soldering skills with the ability to repair complex defects and apply intricate ECO rework. Candidates must have Ball Grid Array (BGA) removal and replacement experience, including BGA removal, site prep, solder application, BGA placement and reflow. They must be able to determine the correct BGA nozzle, stencil and rework profile, identify temperature‑sensitive components or parts (fiber optics, plastic connectors, batteries, etc.),

and have experience with solder paste printing, reflow soldering and component placement machines. Candidates will utilize X‑ray images and visual inspections to validate work for acceptance.

• Knowledge of IPC‑610 and J‑Standards, and hold a current or recent certification (within the last three years).
• Ability to read and understand English documents, drawings, BOMs, work and ECO instructions.
• Follow procedures (SOPs) and documentation.
• In‑depth understanding of Surface‑Mount Technology (SMT) including component package types and SMT assembly process.
• Hand‑solder components as small as 0201 packages.
• Use tools and systems including BGA reworkstation, solder station, electric screwdrivers, torque screwdrivers, wire strippers, pliers, etc.
• Assemble products or sub‑assemblies according to verbal or written instructions, or by following drawings or diagrams.
• Repair damaged circuits, lands, surface‑mount pads, including defects in the base board and mask surface.
• Use microscope soldering and component rework skills and understand repair/rework processes.
• Maintain a high degree of quality workmanship (IPC‑610 class 3 and above).
• Work in a fast‑paced environment and adapt to changing priorities.
• Stand for long periods; walk 200 ft several times a day to wash circuit cards; lift 25 lb or more several times a day.
• Work overtime as needed.
• Perform other duties as required.

• High school diploma or equivalent.
• 7‑10 years of experience in electronics assembly and repair.
• 3 years of BGA removal and replacement experience.
• 2‑4 years of experience operating surface‑mount machines (desired).
• This is an ITAR facility; applicants must be a U.S. citizen or lawful permanent resident.

Sanmina is an Equal Opportunity Employer

This is an ITAR facility and applicants must be a U.S. citizen or lawful permanent resident.