Process Engineer, Plasma Etch

The position is for a Process Engineer, Sr. level Plasma Etch process engineer, but final title and salary will depend on education and previous experience. The engineer will lead the area for process development, process transfer and process improvement in a high-volume manufacturing fab located in San Antonio, TX. The Tower fab in San Antonio is a growing manufacturing site, delivering specialty electronic devices for a wide range of applications and with high quality, low cost, and good cycle times.

A qualified candidate will have excellent process and equipment hands‑on experience, and strong experimental skills. Preference will be given to candidates with prior experience in working with plasmas and understanding of plasma physics. Manufacturing/Industrial experience is a plus.

• Lead the area by establishing directions for improvements, sustaining and overall operation.
• Work closely with process, integration, and yield enhancement engineers to improve process metrics, such as SPC, yield, para metrics and defects.
• Endeavor to achieve first-pass success of technology transfers.
• Identify and define projects for process development and improvement.
• Work with a group of process technicians in projects and daily sustaining activities.
• Ensure matching of newly installed equipment to support production ramp.
• Work with equipment engineering to improve uptime and tool utilization.
• Implement advanced process control to improve Cpk at critical levels.
• Identify cost savings opportunities and drive projects to reduce overall costs.
• Define projects and execute them to completion to improve cost, quality, and productivity.
• Develop and optimize processes to support new product introduction and demonstrate manufacturability.
• Are a true fab engineer and enjoy spending time in the fab running carefully designed experiments.
• The position requires an ability to multitask and react fast to changing conditions.
• The incumbent must recognize problems, limitations, and opportunities.
• The level of responsibility includes making decisions with strong technical implications.
• Due to the existing collaboration between teams, good verbal and written communication skills are needed.

• Ph.D. with 1+ years of experience, M.S. with 5+ years or B.S with 10+ years of experience in Plasma Etch.
• 3+ years of industry experience in conductor plasma etch with an emphasis on aluminum etch
• Major in chemical engineering, electrical engineering, physics, mechanical engineering, materials science, or chemistry
• Excellent written and oral communication skills
• Able to work closely and cordially with others as part of a team to solve difficult problems
• Proven strong skills in statistics, SPC, DOE, and data analysis techniques
• Hands‑on experience with plasma tools and processes, experience with LAM tools is a plus.
• Good understanding of vacuum technology, plasma reactors, and plasma physics
• Some knowledge of device physics and device architecture
• High degree of discipline and organization with the ability to multi‑task and successfully drive multiple projects simultaneously
• Understand cycle time, process flows, and material management
• Analyze problems and develop effective solutions
• Willingness to seek out information and advice from all members of the org. chart to get unstuck from challenging problems
• Willingness to design, execute, and analyze difficult experiments.
• This position requires an engineer who is willing to spend time in the fab working with equipment engineers and technicians troubleshoot and solve difficult problems.