IC Package Design Engineer
Listed on 2026-02-24
-
Engineering
Systems Engineer, Electronics Engineer, Electrical Engineering, Engineering Design & Technologists
Company:
Qualcomm Technologies, Inc.
Job Area:Engineering Group, Engineering Group >
Packaging Engineering
Summary:
The IC Package Architecture and Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products.
Minimum Qualifications:- • Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
- OR
- • Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
- OR
- • PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
- Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, and selection.
- Own and drive advanced package selection, new generation product package structure, and configuration optimization.
- Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.
- Work with multi-functional teams to achieve optimized mechanical, electrical SI/PI, and thermal performance for various types of chips.
- Work with IC PD team on top level floor planning including hard macro block placement, paring, RDL and bump pattern/assignment.
- Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
- Explore, evaluate, and develop new CAD tools, design, and verification flow.
- Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products.
- Basic knowledge in high-speed IO interfaces and electromagnetic field.
- Knowledge of IC packaging structures and package-board interaction.
- Basic knowledge of electronic packaging process and typical failure modes preferred.
- Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
- Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).
- Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).
- Basic understanding of some SI/PI tools (Xtract
IM, Power
SI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model. - Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.
- Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.
- Experience with Calibre tool and package design reviews.
- Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).
- Solid understanding of Design Rules Check and Design for Manufacturing.
- Experience with 2.5D Si-Bridge design in Virtuoso or similar CAD tools is a plus.
Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disabili or call Qualcomm's toll-free number found. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process.
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Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or…
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