Photonics Packaging Engineer

Photonics Packaging Engineer. As we scale, you will be instrumental in building our foundation from the ground up. This is a dynamic, hands-on role for a self-starter who thrives in a fluid startup environment. You'll have the opportunity to work on cutting edge technologies, work closely with leadership, and develop and implement engineering practices that support our mission and growth.

• Accountable for assisting in the design and analysis of laser and photonic products.
• Create innovative laser packages for both free-space and fiber-coupled (single & multimode) outputs.
• Participate in designing the optical architecture of the laser.
• Design hermetic optical and electrical feedthroughs and conduct hermeticity testing.
• Design, analyze, optimize, and test adhesive bonds for structural and thermal applications.
• Develop packages and lids that are suitable for laser welding and parallel seam sealing methods.
• Create electrical routing strategies using wire/ribbon bonding and flexible circuit designs.
• Design and enhance solder joints for die bonding and vacuum reflow bonding purposes.
• Develop solutions for thermal management and control in compact laser packages.
• Utilize computer-aided engineering design software while performing tasks.
• Demonstrate the ability to work autonomously while providing regular progress updates and status reports.
• Design, develop, analyze, document, and assist in testing resilient, precision opto-mechanical assemblies and laser packages.
• Conduct thorough design reviews for both design and manufacturing teams.
• Execute thermal, structural, and vibration modelling of intricate opto-mechanical assemblies.
• Engage in prototyping, assembly, and testing to characterize design objectives.
• Facilitate the procurement of hardware components.
• Prepare engineering change orders and create manufacturing work instructions.
• Develop, acquire, fabricate, and build prototypes to mitigate significant development risks.
• Assist in root cause analysis for failures.
• Provide support and mentorship to junior engineers.

This position requires access to export-controlled information. Employment is contingent upon the applicant being a U.S. person as defined by 8 U.S.C. § 1324b(a)(3).

Bachelors degree in mechanical engineering or related technical field.

Minimum of 5 years of experience, preferably in laser packaging.

• Proficiency in relevant technologies and application areas.
• Capability to independently lead a technical team.
• Experience in laser packaging.
• Experience in packaging photonic integrated circuits.
• Ability to operate engineering testing and optical laboratory equipment.
• Familiarity with optical modeling software, with a preference for Zemax.
• Proficient in CAD software, particularly Solid Works and PDMWorks.
• Experience with finite element analysis (FEA) tools, specifically ANSYS structural and Icepak.
• Knowledge of multimode, single-mode, and polarization-maintaining fiber.

The expected annual salary range for this position is $85,000-$150,000.